AD648JN Analog Devices Inc, AD648JN Datasheet - Page 12

• Manufacturer Part Number: AD648JN
• Description: IC OPAMP BIFET 1MHZ DUAL LP 8DIP
• Manufacturer: Analog Devices Inc

Specifications of AD648JN

• Rohs Status: RoHS non-compliant
• Amplifier Type: J-FET
• Number Of Circuits: 2
• Slew Rate: 1.8 V/µs
• Gain Bandwidth Product: 1MHz
• Current - Input Bias: 5pA
• Voltage - Input Offset: 750µV
• Current - Supply: 340µA
• Current - Output / Channel: 15mA
• Voltage - Supply, Single/dual (±): ±4.5 V ~ 18 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• No. Of Amplifiers: 2
• Bandwidth: 1MHz
• No. Of Pins: 8
• Operating Temperature Range: 0°C To +70°C
• Peak Reflow Compatible (260 C): No
• Input Bias Current: 20pA
• Input Offset Voltage Max: 2mV
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

AD648
Revision History
Location
Data Sheet changed from REV. C to REV. E.
Change to SOIC (R-8) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Edits to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Deleted Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Deleted AD648C column from SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Deleted METALIZATION PHOTOGRAPH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Deleted Metal Can from Figure 22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Deleted TO-99 (H) from OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Dimensions shown in inches and (millimeters)
Mini-DIP (N) Package
COPLANARITY
0.25 (0.0098)
0.10 (0.0040)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012 AA
0.1574 (4.00)
0.1497 (3.80)
PIN 1
SEATING
PLANE
Dimensions shown in millimeters and (inches)
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
8
1
8-Lead SOIC (R) Package
OUTLINE DIMENSIONS
BSC
0.51 (0.0201)
0.33 (0.0130)
5
4
6.20 (0.2440)
5.80 (0.2284)
1.75 (0.0688)
1.35 (0.0532)
–12–
0.25 (0.0098)
0.19 (0.0075)
8
0
0.50 (0.0196)
0.25 (0.0099)
Dimensions shown in inches and (millimeters)
1.27 (0.0500)
0.41 (0.0160)
CERDIP (Q) Package
45
REV. E
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