MC33179DR2G ON Semiconductor, MC33179DR2G Datasheet - Page 18

• Manufacturer Part Number: MC33179DR2G
• Description: IC OPAMP QUAD LP LO NOISE 14SOIC
• Manufacturer: ON Semiconductor

Specifications of MC33179DR2G

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Slew Rate: 2 V/µs
• Gain Bandwidth Product: 5MHz
• Current - Input Bias: 100nA
• Voltage - Input Offset: 1500µV
• Current - Supply: 1.7mA
• Current - Output / Channel: 100mA
• Voltage - Supply, Single/dual (±): 4 V ~ 36 V, ±2 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Number Of Channels: 4
• Common Mode Rejection Ratio (min): 80 dB
• Input Voltage Range (max): Positive Rail - 2 V
• Input Voltage Range (min): Negative Rail + 2 V
• Input Offset Voltage: 3 mV
• Input Bias Current (max): 500 nA
• Operating Supply Voltage: 36 V
• Supply Current: 1.7 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Dual Supply Voltage: +/- 3 V, +/- 5 V, +/- 9 V
• Maximum Dual Supply Voltage: +/- 18 V
• Minimum Dual Supply Voltage: +/- 2 V
• Mounting Style: SMD/SMT
• Shutdown: No
• Technology: Bipolar
• Voltage Gain Db: 106.02 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC33179DR2GOS; MC33179DR2GOS; MC33179DR2GOSTR

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
PACKAGE DIMENSIONS
1
B
1.26
T
H
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
18
SECTION N−N
Ç Ç Ç
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
PITCH
0.65
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE DAMBAR
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.60
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.020
0.004
0.004
0.007
0.007
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_