MCP1804T-3302I/DB Microchip Technology, MCP1804T-3302I/DB Datasheet - Page 23

IC REG LDO 3.3V 150MA SOT223-3

MCP1804T-3302I/DB

Manufacturer Part Number
MCP1804T-3302I/DB
Description
IC REG LDO 3.3V 150MA SOT223-3
Manufacturer
Microchip Technology
Datasheet

Specifications of MCP1804T-3302I/DB

Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
Up to 28V
Voltage - Dropout (typical)
1.3V @ 100mA
Number Of Regulators
1
Current - Output
150mA (Min)
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Input Voltage Max
28 V
Output Voltage
1.8 V
Output Voltage Tolerance
+/- 2 %
Dropout Voltage (max)
710 V
Output Current
150 mA
Line Regulation
0.05 %/V
Load Regulation
275 mV
Maximum Power Dissipation
300 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MCP1804T-3302I/DBTR

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6.0
6.1
The MCP1804 is most commonly used as a voltage
regulator. It’s low quiescent current and wide input volt-
age make it ideal for Li-Ion and 12V battery-powered
applications.
FIGURE 6-1:
6.1.1
6.2
6.2.1
The internal power dissipation of the MCP1804 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(50.0 µA x V
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
© 2009 Microchip Technology Inc.
Where:
Package Type
Input Voltage Range
V
V
I
OUT
I
50 mA
IN
OUT
OUT
P
V
LDO
V
OUT(MIN)
V
1.8V
maximum
IN(MAX)
OUT
typical
P
APPLICATION CIRCUITS AND
ISSUES
Typical Application
Power Calculations
LDO
=
APPLICATION INPUT CONDITIONS
POWER DISSIPATION
IN
(
V
). The following equation can be used to
= LDO Pass device internal power
= Maximum input voltage
= LDO minimum output voltage
IN MAX )
C
1 µF Ceramic
(
dissipation
OUT
SHDN
V
OUT
Typical Application Circuit.
)
= SOT-23
= 3.8V to 4.2V
= 4.6V
= 1.8V
= 50 mA maximum
V
OUT MIN
(
GND
NC
V
IN
)
) I
×
OUT MAX )
C
1 µF
4.2V
Ceramic
V
(
IN
IN
)
The maximum continuous operating temperature
specified for the MCP1804 is +85
internal junction temperature of the MCP1804, the total
internal power dissipation is multiplied by the thermal
resistance from junction to ambient (Rθ
resistance from junction to ambient for the SOT-23 pin
package is estimated at 256
EQUATION 6-2:
The maximum power dissipation capability for a
package can be calculated given the junction-
to-ambient thermal resistance and the maximum
ambient temperature for the application. The following
equation can be used to determine the package
maximum internal power dissipation.
EQUATION 6-3:
EQUATION 6-4:
EQUATION 6-5:
Where:
Where:
Where:
Where:
T
P
P
T
T
T
T
T
J(MAX)
P
TOTAL
AMAX
D(MAX)
Rq
A(MAX)
J(RISE)
J(RISE)
J(MAX)
TOTAL
Rq
Rq
JA
T
T
T
JA
JA
J MAX
A
P
J
(
D MAX
=
=
=
=
T
(
=
=
=
=
=
=
=
=
=
=
J RISE
(
)
Maximum continuous junction
temperature.
Total device power dissipation.
Thermal resistance from junction to
ambient.
Maximum ambient temperature.
T
Maximum device power dissipation.
Maximum continuous junction
temperature.
Maximum ambient temperature.
Thermal resistance from junction to
ambient.
Rise in device junction temperature over
the ambient temperature.
Maximum device power dissipation.
Thermal resistance from junction to
ambient.
Junction Temperature.
Rise in device junction temperature over
the ambient temperature.
Ambient temperature.
=
)
J
=
)
P
=
TOTAL
=
(
---------------------------------------------------
T
T
J RISE
P
J MAX
(
(
D MAX
(
×
°
C/W.
R
R
)
)
MCP1804
+
θ
θ
)
JA
JA
×
T
T
A
A MAX
R
+
°
(
C
θ
T
DS22200B-page 23
JA
.
AMAX
To estimate the
JA
)
)
). The thermal

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