MCP1701AT-3302I/MB Microchip Technology, MCP1701AT-3302I/MB Datasheet - Page 13

IC LDO REG 150MA 3.3V SOT-89-3

MCP1701AT-3302I/MB

Manufacturer Part Number
MCP1701AT-3302I/MB
Description
IC LDO REG 150MA 3.3V SOT-89-3
Manufacturer
Microchip Technology
Datasheet

Specifications of MCP1701AT-3302I/MB

Package / Case
SC-62, SOT-89, TO-243 (3 Leads + Tab)
Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
Up to 10V
Voltage - Dropout (typical)
0.4V @ 150mA
Number Of Regulators
1
Current - Output
150mA (Min)
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Number Of Outputs
1
Polarity
Positive
Input Voltage Max
10 V
Output Voltage
3.3 V
Output Type
Fixed
Dropout Voltage (max)
0.7 V @ 150 mA
Output Current
0.15 A (Min)
Line Regulation
0.3 %/V
Load Regulation
2.72 %
Voltage Regulation Accuracy
2 %
Maximum Power Dissipation
500 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Primary Input Voltage
4.3V
Output Voltage Fixed
3.3V
Dropout Voltage Vdo
380mV
No. Of Pins
3
Voltage Regulator Case Style
SOT-89
Operating Temperature Range
-40°C To +85°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP1701AT-3302I/MB
Manufacturer:
MICROCHIP
Quantity:
45 000
Part Number:
MCP1701AT-3302I/MB
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Lead Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
2
N
D
b
e1
e
1
Dimension Limits
E1
A2
Units
A2
A1
E1
e1
N
e
A
E
D
L
b
φ
c
E
c
0.89
0.90
0.00
2.10
1.20
2.70
0.15
0.09
0.30
MIN
MILLIMETERS
0.95 BSC
1.90 BSC
NOM
Microchip Technology Drawing C04-130B
3
MCP1701A
MAX
1.45
1.30
0.15
3.00
1.80
3.10
0.60
0.26
0.51
30°
DS21991C-page 13
L
φ

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