AS1364-BTDT-33 austriamicrosystems, AS1364-BTDT-33 Datasheet - Page 10

• Manufacturer Part Number: AS1364-BTDT-33
• Description: IC REG LDO 1A 3.3V 8-TDFN
• Manufacturer: austriamicrosystems

Specifications of AS1364-BTDT-33

• Package / Case: 8-WDFN Exposed Pad
• Mounting Type: Surface Mount
• Current - Output: 1A (Min)
• Voltage - Output: 3.3V
• Voltage - Input: Up to 5.5V
• Operating Temperature: -40°C ~ 85°C
• Regulator Topology: Positive Fixed
• Voltage - Dropout (typical): 0.14V @ 1A
• Number Of Regulators: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -

AS1364
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 17. Adjustable Output Voltage Typical Application
Shutdown
If pin EN is connected to GND the AS1364 is disabled. In shutdown mode all internal circuits are turned off, reducing
supply current to 10nA (typ). For normal device operation pin EN must be connected to IN. During shutdown, POK
goes low.
Power-OK
The AS1364 features a power-ok indicator that asserts when the output voltage falls out of regulation. The open-drain
POK output goes low when output voltage at OUT falls 6% below its nominal value. A 100kΩ pull-up resistor from POK
to a (typically OUT) provides a logic control signal.
POK can be used as a power-on-reset (POR) signal to a microcontroller or can drive an external LED to indicate a
power failure condition.
Note: POK is low during shutdown.
Current Limiter
The AS1364 features current limiting circuitry that monitors the pass transistor, limiting short-circuit output current to
1.5A (typ). The circuitry of the AS1364 allows that the output can be shorted to ground for an indefinite period of time
without damaging the device.
Thermal Protection
Integrated thermal overload protection limits the total power dissipation in the AS1364. When the junction temperature
(T
mately 20ºC.
Note: Regardless of the hysteresis, continuous short-circuit condition will result in a pulsed output.
Operating Region and Power Dissipation
Maximum power dissipation of the AS1364 depends on the thermal resistance of the package and the PCB, the tem-
perature difference between the die junction and ambient air, and the rate of air flow.
The power dissipated in the device is given as:
The maximum power dissipation is calculated:
Where:
T
θ
θ
Connect the exposed thermal pad and GND to circuit ground by using a large pad, or multiple vias to the ground plane.
www.austriamicrosystems.com
JC
CA
J(MAX)
J
) exceeds +170ºC typically, the pass transistor is turned off. Normal operation is continued when T
is the thermal resistance of the junction to the case.
is the thermal resistance from the case through the PCB, copper traces, and other materials to the surrounding air.
- T
AMB
V
is the temperature difference between the device die junction and the surrounding air.
IN
C
4.7µF
On
Off
IN
PDMAX = (T
GND
EN
IN
IN
4
3
2
8
PD = I
J(MAX)
OUT
AS1364
Revision 1.00
~ (V
- T
IN
AMB
- V
)/(
OUT
θ
JC
)
+
θ
CA
5
OUT
6
OUT
1
POK
7
SET/BYP
)
R
R
1
2
C
4.7µF
OUT
J
Reset Output
drops approxi-
V
OUT
10 - 14
(EQ 3)
(EQ 4)