CS8361YDPSR7G ON Semiconductor, CS8361YDPSR7G Datasheet - Page 6

• Manufacturer Part Number: CS8361YDPSR7G
• Description: IC REG LDO DUAL 5V MCRPWR D2PAK
• Manufacturer: ON Semiconductor

Specifications of CS8361YDPSR7G

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: 6 ~ 26 V
• Voltage - Dropout (typical): 0.4V @ 250mA, 0.4 @ 100mA
• Number Of Regulators: 2
• Current - Output: 250mA, 100mA
• Current - Limit (min): 275mA, 125mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-263-7, D²Pak (7 leads + Tab), TO-263CA
• Number Of Outputs: 2
• Polarity: Positive
• Input Voltage Max: 60 V
• Output Voltage: 5 V
• Output Type: Fixed
• Dropout Voltage (max): 0.15 V at 100 uA
• Output Current: 100 mA, 250 mA
• Line Regulation: 50 mV
• Load Regulation: 50 mV
• Voltage Regulation Accuracy: 2 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Voltage Regulator Type: Linear
• Topology: LDO
• Regulator Output Type: Fixed
• Polarity Type: Positive
• Input Voltage (max): 60V
• Package Type: D2PAK
• Output Voltage Accuracy: ±2%
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Dropout Voltage@current (max): 0.15@100uA/0.7@250mA
• Dropout Voltage@current (typ): 0.1@100uA/0.4@250mA
• Pin Count: 7 +Tab
• Mounting: Surface Mount
• Quiescent Current (max): 50mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: CS8361YDPSR7G; CS8361YDPSR7GOSTR

Heat Sinks
package to improve the flow of heat away from the IC and
into the surrounding air.
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of R
ORDERING INFORMATION*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe-
*Contact your local sales representative for other package options including PSOP−20, TO−220−7, DIP−16, and SO−20L.
CS8361YDPS7G
CS8361YDPSR7G
CS8361YDWF16G
CS8361YDWFR16G
A heat sink effectively increases the surface area of the
Each material in the heat flow path between the IC and the
cifications Brochure, BRD8011/D.
R QJA + R QJC ) R QCS ) R QSA
Device
qJA:
http://onsemi.com
(3)
6
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
D
D
Package
SO−16L
SO−16L
where:
R
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
2
2
PAK−7
PAK−7
qJA
R
R
R
R
qJC
qCS
qSA
qJC
, it too is a function of package type. R
= the junction−to−case thermal resistance,
appears in the package section of the data sheet. Like
= the case−to−heatsink thermal resistance, and
= the heatsink−to−ambient thermal resistance.
1000 / Tape & Reel
750 / Tape & Reel
50 Units/Rail
46 Units/Rail
Shipping
qCS
and R
†
qSA
are