RR0816P-4990-D-68A Susumu, RR0816P-4990-D-68A Datasheet - Page 11

• Manufacturer Part Number: RR0816P-4990-D-68A
• Description: RES 499 OHM 1/16W .5% 0603 SMD
• Manufacturer: Susumu
• Series: RRr

Specifications of RR0816P-4990-D-68A

• Resistance (ohms): 499
• Power (watts): 0.063W, 1/16W
• Composition: Thin Film
• Temperature Coefficient: ±25ppm/°C
• Tolerance: ±0.5%
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height: 0.016" (0.40mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 0603 (1608 Metric)
• Resistance In Ohms: 499
• Case: 0603 (1608 metric)
• Resistance: 499 Ohms
• Power Rating: 0.0625 Watt (1/16 Watt)
• Voltage Rating: 75 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Termination Style: SMD/SMT
• Dimensions: 0.8 mm W x 1.6 mm L x 0.4 mm H
• Product: Thin Film Resistors SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Details
• Other names: RR0816P-4990-D; RR0816P4990D; RR08P499DTR

TITLE:
Test board
Mounting method
(1) Mounting method according to solder bath method
(2) Mounting method according to reflow soldering method
Test board A ( For substrate banding, adhesion test,
Test board B( For another test,
Epoxy based adhesive agent shall be applied in the middle between the lands of the test board and the
resistor shall be mounted in such a way that resistor's electrodes will be evenly placed in the land area
and then the adhesive agent shall be hardened. Then a methanol medium of 25% colophony by specific
weight is used as flux (if non-deviant test results are assurable over the counter colophony based flux
may be used) and is soldered by dipping in a molten solder bath of 260±5 deg C and immersed for 3 to
5 s.
About 200 μm of solder cream is applied in the land portion of the test boards and the resistor shall be
mounted in such a way so that the resistor's electrodes will be evenly placed on the land. It is soldered
under the conditions of board surface temperature 240 to 250deg C(peak temperature) for 5 to 10 s. in
an upper-portion heated oven.
Chip resistor RR0816 series
Material: Glass fabric base epoxy resin 1.6mm
Copper foil, thickness 0.035 mm
Solder resist coating
Material: Glass fabric base epoxy resin 1.6mm
Copper foil, thickness 0.035 mm
Solder resist coating
Specification for
see Fig.5)
SUSUMU
CO.,LTD
see Fig.4)
SPEC.NO:
RR00-1098
Rev. No.
11/16
0