MBB02070C1104FRP00 Vishay, MBB02070C1104FRP00 Datasheet - Page 11

• Manufacturer Part Number: MBB02070C1104FRP00
• Description: RES 1.10M OHM METL FILM .60W 1%
• Manufacturer: Vishay
• Series: MBB 0207r

Specifications of MBB02070C1104FRP00

• Temperature Coefficient: ±50ppm/°C
• Resistance (ohms): 1.1M
• Power (watts): 0.6W
• Composition: Metal Film
• Tolerance: ±1%
• Size / Dimension: 0.098" Dia x 0.256" L (2.50mm x 6.50mm)
• Lead Style: Through Hole
• Package / Case: Axial
• Resistance In Ohms: 1.10M
• Case: Axial
• Resistance: 1.1Mohm
• Resistance Tolerance: ± 1%
• Power Rating: 600mW
• Voltage Rating: 300V
• Resistor Element Material: Metal Film
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Height: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
• Other names: 2312 815 11105; 2312 915 11105; B0207C1M100F5TBC; BC1.10MZTR

MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Professional
Vishay Beyschlag
Note
(1)
(2)
(3)
(4)
www.vishay.com
32
TEST PROCEDURES AND REQUIREMENTS
CLAUSE
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.13
4.19
4.29
4.18.2
4.17
4.22
4.16
4.7
4.40
60115-1
± (0.4 % R + 0.05 Ω) for MBE/SMA 0414
± (0.8 % R + 0.05 Ω) for MBE/SMA 0414
± (0.2 % R + 0.05 Ω) for MBE/SMA 0414
± (0.4 % R + 0.05 Ω) for MBE/SMA 0414
IEC
METHOD
60068-2-
21 (Ua
30 (Db)
30 (Db)
14 (Na)
45 (XA)
21 (Ub)
21 (Uc)
20 (Tb)
20 (Ta)
13 (M)
2 (Ba)
1 (Aa)
6 (B4)
TEST
IEC
-
-
-
1
)
of temperature
Robustness of
soldering heat
Rapid change
Resistance to
Voltage proof
(human body
terminations
Solderability
Electrostatic
Damp heat,
Damp heat,
Component
sequence:
Short time
resistance
discharge
pressure
Vibration
Dry heat
overload
Climatic
Low air
solvent
model)
TEST
cyclic
cyclic
Cold
For technical questions, contact:
Professional Thin Film Leaded Resistors
30 min at LCT = - 55 °C
30 min at UCT= 155 °C
U = 2.5 x
6 h; 10 Hz to 2000 Hz
MBA/SMA 0204: 2 kV
MBB/SMA 0207: 4 kV
MBE/SMA 0414: 6 kV
Stability for product
types:
Tensile, bending and
solder bath method;
solder bath method;
1.5 mm or 196 m/s
Room temperature;
+ 23 °C; toothbrush
90 % to 100 % RH;
95 % to 100 % RH;
U = 2 x U
U
MBA/SMA 0204:
MBB/SMA 0207:
MBE/SMA 0414:
Isopropyl alcohol
IEC 61340-3-1;
3 pos. + 3 neg.
PROCEDURE
15 °C to 35 °C
55 °C; 5 days;
RMS
components;
+ 235 °C; 2 s
+ 245 °C; 3 s
155 °C; 16 h
8.5 kPa; 2 h;
(260 ± 3) °C;
SnAg3Cu0.5
55 °C; 24 h;
Unmounted
MBA/SMA 0204
MBB/SMA 0207
- 55 °C; 2 h
MBE/SMA 0414
500 cycles
200 cycles
100 cycles
(10 ± 1) s
5 cycles
5 cycles
SnPb40
method
1 cycle
torsion
= U
P
max.
ins
70
; 60 s
x R
; 5 s
or
2
[e-mail]
± (0.5 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω)
± (0.1 % R + 0.01 Ω)
± (0.5 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω)
± (0.1 % R + 0.01 Ω)
± (0.1 % R + 0.01 Ω)
1 Ω to 2.4 MΩ
1 Ω to 332 kΩ
1 Ω to 1 MΩ
STABILITY
CLASS 0.5
no visible
no visible
no visible
damage
damage
damage
Good tinning (> 95 % covered, no visible damage)
PERMISSIBLE CHANGE (ΔR max.)
No flashover or breakdown
± (0.5 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
REQUIREMENTS
no visible damage
± (1 % R + 0.05 Ω)
Marking legible;
0.22 Ω to < 1 Ω
0.22 Ω to < 1 Ω
0.22 Ω to < 1 Ω
STABILITY
CLASS 1
no visible
no visible
no visible
damage
damage
damage
Document Number: 28766
± (0.5 % R + 0.05 Ω)
Revision: 23-Jul-10
STABILITY
± 0.5 % R
± 0.5 % R
± 0.5 % R
± 0.5 % R
± 0.5 % R
CLASS 2
> 332 kΩ
> 2.4 MΩ
no visible
no visible
no visible
± 2 % R
damage
damage
damage
> 1 MΩ