ESDALC6V1-1BU2 STMicroelectronics, ESDALC6V1-1BU2 Datasheet
ESDALC6V1-1BU2
Specifications of ESDALC6V1-1BU2
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ESDALC6V1-1BU2 Summary of contents
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... ESD protection 2 Pin 1 available in different forms Figure 1. Description The ESDALC6V1-1BU2 is a bidirectional single line TVS diode designed to protect data lines or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required ...
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... Test conditions Square pulse T ° amb MHz, V line R osc 2/ °C) amb Parameter °C) amb = 2.5 µs p (25 ° osc Doc ID 15583 Rev 3 ESDALC6V1-1BU2 Value ±8 ±15 1 +150 260 -40 to +125 Min. Typ. Max. 6 100 - 2 Unit kV A °C °C °C Unit /°C pF ...
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... ESDALC6V1-1BU2 Figure 3. Relative variation of peak pulse power versus initial junction temperature 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 T (°C) 0 Figure 5. Junction capacitance versus reverse applied voltage (typical values ( Figure 7. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 10 V/Div Figure 4 ...
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... Characteristics Figure 9. S21 attenuation measurement results Figure 10. Static characteristic 4/11 dB 0.00 - 6.00 -12.00 -18.00 -24.00 - 30.00 100.0k 1.0M 10. -25 -20 -15 - Doc ID 15583 Rev 3 ESDALC6V1-1BU2 F (Hz) 100.0M 1. ...
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... ESDALC6V1-1BU2 2 Ordering information scheme Figure 11. Ordering information scheme ESD Array Low capacitance Breakdown Voltage 6V1 = 6.1 V min Direction B = Bidirectional Package U2 = ST0201 Doc ID 15583 Rev 3 Ordering information scheme ESDA LC 6V1 - 1B U2 5/11 ...
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... Top Side Bottom Bottom e Figure 13. Marking 0.30 Doc ID 15583 Rev 3 ESDALC6V1-1BU2 Dimensions Millimetres Inches Min Typ Max Min A 0.23 0.28 0.33 0.009 0.011 0.013 b1 0.13 0.18 0.23 0.005 0.007 0.009 b2 0.14 0.19 0.24 0.006 0.007 0.009 D 0.55 0.60 0.65 0.022 0.024 0.026 E 0 ...
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... ESDALC6V1-1BU2 Figure 14. Tape and reel specifications 0.22 0.34 All dimensions are typical values in mm Bar indicates Pin 1 4.0 2.0 0.38 User direction of unreeling Doc ID 15583 Rev 3 Package information Ø 1.55 2.0 7/11 ...
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... Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. 8/11 1.05 0.425 0.425 0.225 0.040 0.065 0.20 Stencil window Footprint Doc ID 15583 Rev 3 ESDALC6V1-1BU2 0.30 0.038 0.320 0.038 ...
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... ESDALC6V1-1BU2 4.3 Placement 1. Manual positioning is not recommended recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ±0. recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages ...
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... Document revision history Date 25-Jun-2009 25-Jan-2010 12-Aug-2010 10/11 Marking Weight (1) D1 0.124 mg Revision 1 Initial release. 2 Updated base qty inTable 4. Updated package illustrations 3 available forms. Doc ID 15583 Rev 3 ESDALC6V1-1BU2 Base qty Delivery mode 15000 Tape and reel Changes on page 1 and in Table 3 for Pin 1 ...
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... ESDALC6V1-1BU2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...