MCIMX253CJM4A Freescale Semiconductor, MCIMX253CJM4A Datasheet - Page 152

• Manufacturer Part Number: MCIMX253CJM4A
• Description: IC MPU IMX25 IND 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX253CJM4A

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-MAPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

5
Table 108
152
Rev.
8
7
6
5
4
3
2
1
0
Revision History
summarizes revisions to this document.
01/2011
12/2010
09/2010
08/2010
06/2010
03/2010
12/2009
10/2009
6/2009
Date
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
Initial release.
• In
• In
• Updated the first paragraph of
• Updated
• Updated the third note for
• Added
• Added
• Added a note for the line NVCC_DRYICE in
• Updated
• Added a note for the line NVCC_DRYICE in
• Removed records for UPLL_BYPCLK, USBPHY2_DP, USBPHY1RREF, USBPHY1_DM,
• Updated
• Added
• Updated
• Updated
• Updated
• Updated
• Added
• Added
• Added
• Added
• Added
• Added
• Updated
• Updated
• Updated DRYICE description in
• Updated REF signal description in
• Updated ESD damage immunity values in
• Updated values in
• Added a note on timing in
• Added
• Updated
• Updated values in
• Updated
updated to 133 MHz.
specification has been updated to 133 MHz.
Sense, and Reference Contact Assignments," on page
Sense, and Reference Contact Assignments," on page
USBPHY1_DP, USBPHY1_UID, USBPHY1_VBUS, and USBPHY2_DM contacts from
Table 104, "12x12 mm Package Ground, Power Sense, and Reference Contact Assignments,"
on page
FUSE_VDD.
mm, 0.5 mm Pitch.”
Table 27, "AC Parameters for SDRAM I/O," on page
Table 28, "AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O," on page
Table 9, "Recommended External Crystal Specifications," on page
Table 10, "Recommended External Reference Clock Specifications," on page
Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Table
Section 3.3, “Power Characteristics.”
Section 4.5, “347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch.”
Section 4.6, “Ground, Power, Sense, and Reference Contact Assignments Case 12x12
Section 4.7, “Signal Contact Assignments—12 x 12 mm, 0.5 mm
Section 4.8, “i.MX25 12x12 Package Ball Map.”
Table
139.
Table 4, "Signal Considerations," on page 9
Table 101, "17×17 mm Package i.MX25 Signal Contact Assignment," on page
Table 105, "12x12 mm Package i.MX25 Signal Contact Assignment," on page
Table 56, "WEIM Bus Timing Parameters," on page 71
Table 6, "DC Operating Conditions," on page 11
Table
Table
Table
Table 1, “Ordering Information,”
Table
Table
2,
14,
1,
1,
1,
55,
85,
“i.MX25 Parts Functional Differences.”
“iMX25 Reduced Power Mode Current Consumption.”
“Ordering Information,”
“Ordering Information,”
“Ordering Information,”
Table 108. Revision History
Table
Table
“NFC Timing Parameters.”
“Touchscreen ADC Electrical Specifications.”
13,
56,
Table 6, "DC Operating Conditions," on page 11.
Section 3.2.1, “Power-Up Sequence.”
“i.MX25 Power Mode Current Consumption.”
“WEIM Bus Timing Parameters.
Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Table
Table
3,
“i.MX25 Digital and Analog Modules.”
4,
to include new part numbers.
to include new part numbers.
to include new part numbers.
to include new part numbers.
Revision
Table
“Signal Considerations.”
Table 100, "17 × 17 mm Package Ground, Power
Table 104, "12x12 mm Package Ground, Power
5,
“DC Absolute Maximum Ratings.”
for NVCC_DRYICE signal.
37, the frequency specification has been
125.
139.
to include Min and Max values of
to include new row for WE19.
Pitch.
Freescale Semiconductor
13.
38, the frequency
13.
141.
127.