MC9328MXLVM20R2 Freescale Semiconductor, MC9328MXLVM20R2 Datasheet - Page 4

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MC9328MXLVM20R2

Manufacturer Part Number
MC9328MXLVM20R2
Description
IC MCU I.MX 200MHZ 256-MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MXLr
Datasheet

Specifications of MC9328MXLVM20R2

Core Processor
ARM9
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, I²C, Memory Stick, MMC/SD, SPI, SSI, UART/USART, USB
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
97
Program Memory Type
ROMless
Voltage - Supply (vcc/vdd)
1.7 V ~ 3.3 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
256-MAPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Ram Size
-
Program Memory Size
-
Data Converters
-

Available stocks

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Manufacturer
Quantity
Price
Part Number:
MC9328MXLVM20R2
Manufacturer:
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Quantity:
10 000
Company:
Part Number:
MC9328MXLVM20R2
Quantity:
199
Signals and Connections
2
Table 2
are grouped by the internal module that they are connected to.
4
A[24:0]
D[31:0]
EB0
EB1
EB2
EB3
OE
CS [5:0]
ECB
LBA
BCLK (burst clock)
RW
DTACK
Signal Name
A pin is an external physical connection. The same pin can be used to connect a number of signals.
Asserted means that a discrete signal is in active logic state.
— Active low signals change from logic level one to logic level zero.
— Active high signals change from logic level zero to logic level one.
Negated means that an asserted discrete signal changes logic state.
— Active low signals change from logic level zero to logic level one.
— Active high signals change from logic level one to logic level zero.
LSB means least significant bit or bits, and MSB means most significant bit or bits. References to
low and high bytes or words are spelled out.
Numbers preceded by a percent sign (%) are binary. Numbers preceded by a dollar sign ($) or 0x
are hexadecimal.
Signals and Connections
identifies and describes the i.MXL processor signals that are assigned to package pins. The signals
Address bus signals
Data bus signals
MSB Byte Strobe—Active low external enable byte signal that controls D [31:24].
Byte Strobe—Active low external enable byte signal that controls D [23:16].
Byte Strobe—Active low external enable byte signal that controls D [15:8].
LSB Byte Strobe—Active low external enable byte signal that controls D [7:0].
Memory Output Enable—Active low output enables external data bus.
Chip-Select—The chip-select signals CS [3:2] are multiplexed with CSD [1:0] and are selected by the
Function Multiplexing Control Register (FMCR). By default CSD [1:0] is selected.
Active low input signal sent by a flash device to the EIM whenever the flash device must terminate an
on-going burst sequence and initiate a new (long first access) burst sequence.
Active low signal sent by a flash device causing the external burst device to latch the starting burst
address.
Clock signal sent to external synchronous memories (such as burst flash) during burst mode.
RW signal—Indicates whether external access is a read (high) or write (low) cycle. Used as a WE input
signal by external DRAM.
DTACK signal—The external input data acknowledge signal. When using the external DTACK signal
as a data acknowledge signal, the bus time-out monitor generates a bus error when a bus cycle is not
terminated by the external DTACK signal after 1022 clock counts have elapsed.
Table 2. i.MXL Signal Descriptions
MC9328MXL Technical Data, Rev. 8
External Bus/Chip-Select (EIM)
Function/Notes
Freescale Semiconductor

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