75005-0004 Molex Inc, 75005-0004 Datasheet
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75005-0004
Specifications of 75005-0004
075005-0004-E
0750050004
0750050004-E
75005-0004-E
750050004
750050004-E
WM17204TR
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75005-0004 Summary of contents
Page 1
... HIGH SPEED MEZZANINE APPLICATION SPECIFICATION BOARD TO BOARD CONNECTOR 75005 Receptacle Assembly 1.0 2.0 3.0 4.0 5.0 6.0 REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: C DATE: 2003 / DOCUMENT NUMBER: AS-75005-001 HIGH SPEED MEZZANINE 75003 Plug Assembly Table of Contents Scope Product Description Applicable Documents and Specifications Insertion and Withdrawal of Connectors 4 ...
Page 2
... PRODUCT DESCRIPTION 2.1 Product Name and Part Numbers: High Speed Mezzanine Connector Plug Assemblies Series 75003 Receptacle Assemblies Series 75005 2.2 Dimensions, Materials, Platings, and Markings: (See appropriate sales drawings for information) 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS Product Specification PS-75005-001 ...
Page 3
... ECR/ECN INFORMATION: UCP2003-2204 EC No: C DATE: 2003 / DOCUMENT NUMBER: AS-75005-001 INSERTION Figure 1 is the preferred method of insertion. Straight insertion of the connectors insures proper alignment during the mating process. Zippering during Insertion: The “zippering” together of the connectors during insertion is permissible. This can reduce the amount of force required to insert the connector ...
Page 4
... Mating Height = (C1 and C2 are the same as Dimension C on the Sales Drawing) REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: C DATE: 2003 / DOCUMENT NUMBER: AS-75005-001 Maximum Offset = 0.85 mm Maximum Offset = 0.85 mm Initial = 0.00mm Initial = 0.00mm Initial = 0.00mm Initial = 0.00mm Ground Mating Area = 0.75mm Ground Mating Area = 0.75mm Ground Mating Area = 0 ...
Page 5
... Note: The 2.00x2.00mm Apetures should be centered over the ground peg plated thru holes. REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: C DATE: 2003 / DOCUMENT NUMBER: AS-75005-001 12 Pair Stencil Shown for Reference TITLE: APPLICATION SPECIFICATION FOR THE HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR SYSTEM CREATED / REVISED BY: Ken Stiles CHECKED BY: ...
Page 6
... However, the connector is fully capable of being used in thicker boards, the only limitations are that it maintain a minimum of 50% peg coverage with a solder fillet. REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: C DATE: 2003 / DOCUMENT NUMBER: AS-75005-001 o C for no longer than 30 seconds /second o C /second. TITLE: ...
Page 7
... REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: C DATE: 2003 / DOCUMENT NUMBER: AS-75005-001 Solder Fillet Solder Fillet Nominal 0.062(1.57mm) thick board Nominal 0.062(1.57mm) thick board With 100% Peg Coverage. With 100% Peg Coverage. A good solder joint requires 50% Peg Coverage MIN., A good solder joint requires 50% Peg Coverage MIN., with a solder fillet at the top of the joint ...
Page 8
... Not Tooled 75005-0306 75003-0305 75005-0006 75003-0005 75005-0304 75003-0308 75005-0004 75003-0008 75005-0104 Not Tooled 75005-0204 Not Tooled 75005-0304 75003-0310 75005-0004 75003-0010 75005-0104 75003-0110 75005-0204 75003-0210 75005-0306 75003-0308 75005-0006 75003-0008 CHECKED BY: APPROVED BY: Ken Stiles Manny Banakis TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC SHEET No. ...
Page 9
... TITLE: APPLICATION SPECIFICATION FOR THE HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR SYSTEM CREATED / REVISED BY: Ken Stiles Receptacle P/N Plug P/N 75005-0304 Not Tooled 75005-0004 Not Tooled 75005-0104 Not Tooled 75005-0204 Not Tooled 75005-0306 75003-0310 75005-0006 75003-0010 Not Tooled Not Tooled ...