75005-0004 Molex Inc, 75005-0004 Datasheet - Page 7

• Manufacturer Part Number: 75005-0004
• Description: CONN RECEPT 24POS 1.2MM VERT SMD
• Manufacturer: Molex Inc
• Series: Plateau HS Mezz™ 75005r

Specifications of 75005-0004

• Connector Type: Differential Pair Array, Female
• Number Of Positions: 24
• Pitch: 0.047" (1.20mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Mated Stacking Heights: 10mm, 13mm, 15mm
• Height Above Board: 0.285" (7.24mm)
• Pitch Spacing: 1.2mm
• No. Of Contacts: 24
• Gender: Receptacle
• Contact Plating: Gold
• No. Of Rows: 2
• Contact Termination: Surface Mount Vertical
• Product Type: Receptacles
• Mounting Style: Wire
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 14
• Housing Material: High Temperature Thermoplastic
• Contact Material: High Performance Alloy (HPA)
• Voltage Rating: 30 V
• Current Rating: 1.5 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 075005-0004; 075005-0004-E; 0750050004; 0750050004-E; 75005-0004-E; 750050004; 750050004-E; WM17204TR

REVISION:
DOCUMENT NUMBER:
C
5.4 Inspection:
NOTE: The Ground Peg has been tested and qualified without protruding below the surface of the PCB. This
AS-75005-001
ECR/ECN INFORMATION:
EC No:
DATE:
connector uses a Pin-thru-Paste application and only requires that >50% of the peg is covered with
solder with a solder fillet at the top.
UCP2003-2204
2003 / 04 / 09
APPLICATION SPECIFICATION
HIGH SPEED MEZZANINE
TITLE:
CREATED / REVISED BY:
Ken Stiles
Best Case 100% Peg Coverage
Worst Case 50% Peg Coverage
BOARD TO BOARD CONNECTOR SYSTEM
APPLICATION SPECIFICATION FOR THE
Nominal 0.072(1.83mm) thick board
Nominal 0.072(1.83mm) thick board
With 50% Hole Fill.
With 50% Hole Fill.
A good solder joint requires 50% Peg Coverage MIN.,
A good solder joint requires 50% Peg Coverage MIN.,
with a solder fillet at the top of the joint.
with a solder fillet at the top of the joint.
Nominal 0.062(1.57mm) thick board
Nominal 0.062(1.57mm) thick board
With 100% Peg Coverage.
With 100% Peg Coverage.
A good solder joint requires 50% Peg Coverage MIN.,
A good solder joint requires 50% Peg Coverage MIN.,
with a solder fillet at the top of the joint.
with a solder fillet at the top of the joint.
Solder Fillet
Solder Fillet
HIGH SPEED MEZZANINE
Solder Fillet
Solder Fillet
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Manny Banakis
APPROVED BY:
SHEET No.
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