75003-0010 Molex Inc, 75003-0010 Datasheet - Page 7

• Manufacturer Part Number: 75003-0010
• Description: CONN PLUG 24POS 1.2MM VERT SMD
• Manufacturer: Molex Inc
• Series: Plateau HS Mezz™ 75003r

Specifications of 75003-0010

• Connector Type: Differential Pair Array, Male
• Number Of Positions: 24
• Pitch: 0.047" (1.20mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Mated Stacking Heights: 15mm, 17mm, 25mm
• Height Above Board: 0.522" (13.25mm)
• Pitch Spacing: 1.2mm
• No. Of Contacts: 24
• Gender: Plug
• Contact Plating: Gold
• No. Of Rows: 2
• Contact Termination: Surface Mount Vertical
• Product Type: Receptacles
• Mounting Style: Wire
• Number Of Positions / Contacts: 4
• Housing Material: High Temperature Thermoplastic
• Contact Material: High Performance Alloy (HPA)
• Voltage Rating: 30 V
• Current Rating: 1.5 A
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 075003-0010; 075003-0010-C; 0750030010; 0750030010-C; 75003-0010-C; 750030010; 750030010-C; WM17213

REVISION:
DOCUMENT NUMBER:
C
5.4 Inspection:
NOTE: The Ground Peg has been tested and qualified without protruding below the surface of the PCB. This
AS-75005-001
ECR/ECN INFORMATION:
EC No:
DATE:
connector uses a Pin-thru-Paste application and only requires that >50% of the peg is covered with
solder with a solder fillet at the top.
UCP2003-2204
2003 / 04 / 09
APPLICATION SPECIFICATION
HIGH SPEED MEZZANINE
TITLE:
CREATED / REVISED BY:
Ken Stiles
Best Case 100% Peg Coverage
Worst Case 50% Peg Coverage
BOARD TO BOARD CONNECTOR SYSTEM
APPLICATION SPECIFICATION FOR THE
Nominal 0.072(1.83mm) thick board
Nominal 0.072(1.83mm) thick board
With 50% Hole Fill.
With 50% Hole Fill.
A good solder joint requires 50% Peg Coverage MIN.,
A good solder joint requires 50% Peg Coverage MIN.,
with a solder fillet at the top of the joint.
with a solder fillet at the top of the joint.
Nominal 0.062(1.57mm) thick board
Nominal 0.062(1.57mm) thick board
With 100% Peg Coverage.
With 100% Peg Coverage.
A good solder joint requires 50% Peg Coverage MIN.,
A good solder joint requires 50% Peg Coverage MIN.,
with a solder fillet at the top of the joint.
with a solder fillet at the top of the joint.
Solder Fillet
Solder Fillet
HIGH SPEED MEZZANINE
Solder Fillet
Solder Fillet
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Manny Banakis
APPROVED BY:
SHEET No.
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