AMMP-5620-TR1G Avago Technologies US Inc., AMMP-5620-TR1G Datasheet - Page 10

• Manufacturer Part Number: AMMP-5620-TR1G
• Description: IC MMIC AMP HGA 6-20GHZ 8SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMP-5620-TR1G

• Gain: 17.5dB
• Rf Type: General Purpose
• Current - Supply: 95mA
• Frequency: 6GHz ~ 20GHz
• Noise Figure: 5.1dB
• P1db: 14.8dBm
• Package / Case: 8-SMD
• Test Frequency: 18GHz
• Voltage - Supply: 5V
• Frequency Range: 6GHz To 20GHz
• Noise Figure Typ: 5.1dB
• Power Dissipation Pd: 1W
• Supply Current: 95mA
• Supply Voltage Range: 5V
• Rf Ic Case Style: SMD
• Number Of Channels: 1
• Frequency (max): 20GHz
• Power Supply Requirement: Single
• Single Supply Voltage (typ): 5V
• Package Type: SMT
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Pin Count: 8
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
4. Apply solder paste using a stencil printer or dot
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak
Outline Drawing
0
Figure 24.Outline Drawing.
A
Please see recommended solder reflow profile.
Conductive
epoxy is not recommended. Hand soldering is not
recommended.
placement.
The volume of solder paste will be dependent on PCB and
component layout and should be controlled to ensure
consistent mechanical and electrical performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temperature to avoid
damage due to thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
NOTES:
1.
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
SYMBOL
A
B
DIMENSIONS ARE IN INCHES (MM)
8
*
INDICATES PIN 1
AMMP
XXXX
YWWDNN
FRONT VIEW
1
7
0.0685 (1.74)
0.198 (5.03)
MIN.
A
2
6
3
5
0.088 (2.25)
0.213 (5.4)
MAX.
4
SIDE VIEW
B
0.126
(3.2)
0.029 (0.75)
DIMENSIONAL TOLERANCE FOR BACK VIEW: 0.002" (0.05 mm)
0.059
(1.5)
0.016 (0.40)
0.100 (2.54)
0.100 (2.54)
0.011 (0.28)
4
BACK VIEW
0.114 (2.90)
0.018 (0.46)
3
0.93 (2.36)
5
2
6
1
7
*
0.028 (0.70)
8
0.012 (0.30)
0.014 (0.365)
0.016 (0.40)