AMMP-5618-TR1 Avago Technologies US Inc., AMMP-5618-TR1 Datasheet - Page 8
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AMMP-5618-TR1
Manufacturer Part Number
AMMP-5618-TR1
Description
IC AMP GP HI PWR 6-20GHZ 8-SMD
Manufacturer
Avago Technologies US Inc.
Datasheet
1.AMMP-5618-BLK.pdf
(9 pages)
Specifications of AMMP-5618-TR1
Gain
13dB
Current - Supply
107mA ~ 140mA
Frequency
6GHz ~ 20GHz
Noise Figure
4.4dB
P1db
19dBm
Package / Case
8-QFN
Rf Type
ISM, MMDS, WLL, 802.16/WiMAX, DBS, VSAT
Voltage - Supply
5V
Frequency Range
6GHz To 20GHz
Noise Figure Typ
4.4dB
Supply Current
107mA
Supply Voltage Range
5V
Rf Ic Case Style
SMD
No. Of Pins
8
Frequency Max
20GHz
Termination Type
SMD
Number Of Channels
1
Frequency (max)
20GHz
Operating Supply Voltage (typ)
5V
Package Type
SMD
Mounting
Surface Mount
Pin Count
8
Noise Figure (typ)
4.4dB
Filter Terminals
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Test Frequency
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AMMP-5618-TR1
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder Reflow Profile
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 24. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 1 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
8
300
250
200
150
100
50
0
0
Ramp 1
50
Preheat
Peak = 250 ±5°C
100
Ramp 2
Seconds
150
Reflow
Melting point = 218°C
200
Cooling
250
300
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 25. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
Figure 25. Stencil Outline Drawing (mm).
Figure 26. Combined PCB and Stencil Layouts (mm).
0.38
0.56
0.1
1.04
0.39
0.3
2.49
0.72
0.36