AMMC-6241-W50 Avago Technologies US Inc., AMMC-6241-W50 Datasheet - Page 7

• Manufacturer Part Number: AMMC-6241-W50
• Description: IC MMIC LO NOISE HIGAIN 26-43GHZ
• Manufacturer: Avago Technologies US Inc.
• Type: General Purposer

Specifications of AMMC-6241-W50

• Function: Amplifier
• Noise Figure Typ: 2.7dB
• Supply Current: 60mA
• Supply Voltage Range: 3V
• Frequency Max: 43GHz
• Frequency Min: 26GHz
• Supply Voltage Max: 7V
• Gain: 20dB
• Number Of Channels: 1
• Frequency (max): 43GHz
• Output Power: 10@38000MHzdBm
• Power Supply Requirement: Single
• Single Supply Voltage (typ): 3V
• Package Type: Chip
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Biasing and Operation
The AMMC-6241 is normally biased with a positive sup-
ply connected to both V
the 100pF bypass capacitor as shown in Figure 21. The
recommended supply voltage is 3 V. It is important to
place the bypass capacitor as close to the die as possible.
No negative gate bias voltage is needed for the AMMC-
6241. Input and output matching are achieved on-die,
therefore no other external component is required
besides one 100pF bypass capacitor for the main sup-
ply. The input and output are DC-blocked with internal
coupling capacitors.
No ground wires are needed because all ground connec-
tions are made with plated through-holes to the backside
of the device.
Refer the Absolute Maximum Ratings table for allowed
DC and thermal conditions.
Assembly Techniques
The backside of the MMIC chip is RF ground. For mi-
crostrip applications the chip should be attached directly
to the ground plane (e.g. circuit carrier or heatsink) using
electrically conductive epoxy
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plate
metal shim (same length and width as the MMIC) under
the chip which is of correct thickness to make the chip
and adjacent circuit the same height. The amount of
epoxy used for the chip and/or shim attachment should
RFin
Figure 18. AMMC-6241 Simplified Schematic
7
D1
and V
[1,2]
.
D2
bond pads through
VD1
be just enough to provide a thin fillet around the bottom
perimeter of the chip or shim. The ground plan should
be free of any residue that may jeopardize electrical or
mechanical attachment.
The location of the RF bond pads is shown in Figure
12. Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable
to minimize performance degradation due to undesir-
able series inductance. A single bond wire is normally
sufficient for signal connections, however double bond-
ing with 0.7 mil gold wire or use of gold mesh is recom-
mended for best performance, especially near the high
end of the frequency band.
Thermosonic wedge bonding is preferred method for
wire attachment to the bond pads. Gold mesh can be at-
tached using a 2 mil round tracking tool and a tool force
of approximately 22 grams and a ultrasonic power of
roughly 55 dB for a duration of 76 +/- 8 mS. The guided
wedge at an untrasonic power level of 64 dB can be used
for 0.7 mil wire. The recommended wire bond stage tem-
perature is 150 +/- 2C.
Caution should be taken to not exceed the Absolute
Maximum
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Eutectic attach is not recommended and may jeopardize reliability
of the device.
VD2
RFout