AMMP-6120-BLK Avago Technologies US Inc., AMMP-6120-BLK Datasheet - Page 8

• Manufacturer Part Number: AMMP-6120-BLK
• Description: 8-24 GHZ FREQ MULTIPLIER X2 SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMP-6120-BLK

• Function: Frequency Multiplier
• Frequency: 4GHz ~ 12GHz
• Rf Type: VSAT, DBS
• Secondary Attributes: Output Power -11 to 5dBm
• Package / Case: 8-QFN
• Supply Current: 85mA
• Supply Voltage Range: 5V
• Rf Ic Case Style: SMD
• No. Of Pins: 8
• Frequency Max: 24GHz
• Termination Type: SMD
• Frequency Min: 8GHz
• Supply Voltage Max: 7V
• Gain: 1dB
• Operating Temperature Max: 150°C
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 516-1853; AMMP-6120-BLK; Q2313336

Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
4. Apply solder paste using a stencil printer or dot place-
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak tem-
Solder Reflow Profile
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated reflow
processes is shown in Figure 23. This profile is designed
to ensure reliable finished joints. However, the profile
indicated in Figure 1 will vary among different solder
pastes from different manufacturers and is shown here for
reference only.
Recommended solder reflow profile
Figure 23. Suggested lead-free reflow profile for SnAgCu solder paste.
8
Please see recommended solder reflow profile. Conduc-
tive epoxy is not recommended. Hand soldering is not
recommended.
ment. The volume of solder paste will be dependent on
PCB and component layout and should be controlled
to ensure consistent mechanical and electrical perfor-
mance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tempera-
ture to the pre-heat temperature to avoid damage due
to thermal shock.
perature of 260qC for 20 seconds. Verify that the profile
will not expose device beyond these limits.
300
250
200
150
100
50
0
0
Ramp 1 Preheat Ramp 2
50
100
Peak = 250°C
Seconds
150
Reflow
Melting point = 218°C
200
Cooling
250
300
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 24. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The combined PCB and stencil layout is shown in below.
Figure 24. Stencil outline drawing (mm).
Figure 25. Combined PCB and stencil layouts (mm).
0.38
0.56
0.1
1.04
0.39
0.3
2.49
0.72
0.36