AMMP-6530-TR2 Avago Technologies US Inc., AMMP-6530-TR2 Datasheet - Page 10

• Manufacturer Part Number: AMMP-6530-TR2
• Description: IC MMIC REJECT MXR 5-30GHZ 8-SMD
• Manufacturer: Avago Technologies US Inc.
• Series: AMMP-6530r

Specifications of AMMP-6530-TR2

• Package / Case: 8-QFN
• Function: Mixer
• Frequency: 5GHz ~ 30GHz
• Rf Type: ISM; DBS; VSAT; 802.16/WiMax; WLL; MMDS
• Maximum Input Frequency: 30000 MHz
• Mounting Style: SMD/SMT
• Maximum Operating Frequency: 5000 MHz
• Maximum Power Gain: - 8 dB
• Operating Supply Voltage: - 3 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
4. Apply solder paste using a stencil printer or dot
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak
10
Please see recommended solder reflow profile. Con-
ductive epoxy is not recommended. Hand soldering is
not recommended.
placement. The volume of solder paste will be de-
pendent on PCB and component layout and should be
controlled to ensure consistent mechanical and electri-
cal performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tempera-
ture to the pre-heat temperature to avoid damage due
to thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
Solder Reflow Profile
The most commonly used solder reflow method is accom-
plished in a belt furnace using convection heat transfer.
The suggested reflow profile for automated reflow
processes is shown in Figure 25. This profile is designed
to ensure reliable finished joints. However, the profile
indicated in Figure 25 will vary among different solder
pastes from different manufacturers and is shown here
for reference only.
Figure 25. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
300
250
200
150
100
50
0
0
Ramp 1
50
Preheat
Peak = 250 ± 5°C
100
Ramp 2
Seconds
150
Reflow
Melting point = 218°C
200
Cooling
250
300