AD8349AREZ Analog Devices Inc, AD8349AREZ Datasheet - Page 2

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AD8349AREZ

Manufacturer Part Number
AD8349AREZ
Description
IC QUADRATURE MOD 700MHZ 16TSSOP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD8349AREZ

Function
Modulator
Lo Frequency
700MHz ~ 2.7GHz
Rf Frequency
700MHz ~ 2.7GHz
P1db
5.6dBm
Noise Floor
-156dBm/Hz
Output Power
5.1dBm
Current - Supply
150mA
Voltage - Supply
4.75 V ~ 5.5 V
Test Frequency
2.14GHz
Package / Case
16-TSSOP Exposed Pad, 16-eTSSOP, 16-HTSSOP
Frequency Range
700MHz To 2700MHz
Rf Type
Quadrature
Supply Voltage Range
4.75V To 5.5V
Rf Ic Case Style
TSSOP
No. Of Pins
16
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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AD8349
TABLE OF CONTENTS
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
Pin Configuration and Functional Descriptions.......................... 6
Equivalent Circuits ........................................................................... 7
Typical Performance Characteristics ............................................. 8
Circuit Description......................................................................... 14
Basic Connections .......................................................................... 15
REVISION HISTORY
11/04—Data Sheet Changed from Rev. 0 to Rev. A
Changes to Figure 25 through Figure 30 ................................11
Changes to Figure 37 through Figure 39 ................................13
Change to WCDMA MultiCarrier Application section .......21
Change to Figure 60 and Figure 61 .........................................21
11/03—Revision 0: Initial Version
ESD Caution.................................................................................. 5
Overview...................................................................................... 14
LO Interface................................................................................. 14
V-to-I Converter......................................................................... 14
Mixers .......................................................................................... 14
D-to-S Amplifier......................................................................... 14
Bias Circuit .................................................................................. 14
Output Enable ............................................................................. 14
Baseband I and Q Inputs ........................................................... 15
Single-Ended Baseband Drive .................................................. 15
LO Input Drive Level ................................................................. 16
Frequency Range ........................................................................ 16
LO Input Impedance Matching ................................................ 16
Single-Ended LO Drive.............................................................. 17
Rev. A | Page 2 of 28
Applications..................................................................................... 21
Evaluation Board ............................................................................ 24
Characterization Setups................................................................. 26
Outline Dimensions ....................................................................... 27
RF Output.................................................................................... 17
Output Enable............................................................................. 17
Baseband DAC Interface ........................................................... 18
AD9777 Interface ....................................................................... 18
Biasing and Filtering .................................................................. 18
Reducing Undesired Sideband Leakage .................................. 19
Reduction of LO Feedthrough ................................................. 19
Sideband Suppression and LO Feedthrough vs. Temperature
....................................................................................................... 20
3GPP WCDMA Single-Carrier Application ........................... 21
WCDMA MultiCarrier Application ........................................ 21
GSM/EDGE Application ........................................................... 22
Soldering Information ............................................................... 23
LO Generation Using PLLs ....................................................... 23
Transmit DAC Options ............................................................. 23
SSB Setup..................................................................................... 26
Ordering Guide .......................................................................... 27

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