SI4010-B1-GT Silicon Laboratories Inc, SI4010-B1-GT Datasheet - Page 27
SI4010-B1-GT
Manufacturer Part Number
SI4010-B1-GT
Description
IC TX 27-960MHZ FSK 3.6V 10MSOP
Manufacturer
Silicon Laboratories Inc
Series
EZRadio®r
Type
ISM Transmitterr
Datasheets
1.4010-DAAKF_434.pdf
(2 pages)
2.SI4010-B1-GS.pdf
(160 pages)
3.SI4010-C2-GS.pdf
(156 pages)
Specifications of SI4010-B1-GT
Package / Case
10-MSOP, Micro10™, 10-uMAX, 10-uSOP
Frequency
27MHz ~ 960MHz
Applications
Garage Openers, RKE, Security Alarms
Modulation Or Protocol
FSK, OOK
Data Rate - Maximum
100 kBaud
Power - Output
10dBm
Current - Transmitting
19.8mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Memory Size
4kB RAM
Features
8051 MCU Core, Crystal-less Operation
Voltage - Supply
1.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Operating Frequency
27 MHz to 960 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Operating Supply Voltage
1.8 V to 3.6 V
Supply Current
10 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
336-1973-5
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Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
1. A stainless steel, laser-cut and electro-polished stencil with
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-
Dimension
between the solder mask and the metal pad is to be 60 µm minimum,
all the way around the pad.
trapezoidal walls should be used to assure good solder paste release.
perimeter pads.
020 specification for Small Body Components.
C1
X1
Y1
E
Table 9.1. PCB Land Pattern Dimensions
Rev. 1.0
5.30
0.50
1.45
MIN
1.27 BSC
MAX
5.40
0.60
1.55
Si4010-C2
27
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