MPXV7002DP Freescale Semiconductor, MPXV7002DP Datasheet - Page 4

• Manufacturer Part Number: MPXV7002DP
• Description: PRESSURE SENSOR DUAL PORT 8-SOP
• Manufacturer: Freescale Semiconductor
• Series: MPXV7002r

Specifications of MPXV7002DP

• Pressure Type: Differential
• Operating Pressure: ±0.3 PSI
• Port Size: Male, 0.13" (3.302mm) Tube, Dual
• Output: 0 ~ 4.5V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: 10°C ~ 60°C
• Package / Case: 8-SOP Dual Port
• Accuracy: 2.5 %
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 60 C
• Minimum Operating Temperature: + 10 C
• Operating Supply Voltage: 5 V
• Supply Voltage (min): 4.75 V
• Supply Voltage (max): 5.25 V
• Supply Current: 10 mA
• Output Voltage: 4.5 V
• Shutdown: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPXV7002
4
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
The performance over temperature is achieved by
Figure 2
The MPXV7002 series pressure sensor operating
Pressure
illustrates the Differential or Gauge configuration
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
Frame
Lead
Wire Bond
1.0 µF
Differential Sensing
Fluoro Silicone
Gel Die Coat
Figure 2. Cross-Sectional Diagram SOP
Element
0.01 µF
(not to scale)
V
s
+5 V
P1
P2
GND
IPS
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
10° to 60°C using the decoupling circuit shown in
The output will saturate outside of the specified pressure
range.
Die
V
out
Figure 3
Figure 4
shows the recommended decoupling circuit for
shows the sensor output signal relative to
470 pF
Steel Cap
Stainless
OUTPUT
Die Bond
Thermoplastic
Case
Freescale Semiconductor
Figure
Sensors
3.