MCP2004-E/P Microchip Technology, MCP2004-E/P Datasheet
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MCP2004-E/P
Specifications of MCP2004-E/P
Related parts for MCP2004-E/P
MCP2004-E/P Summary of contents
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... LIN J2602 Transceiver Features • The MCP2003 and MCP2004 are compliant with LIN Bus Specifications 1.3, 2.0 and 2.1 and are compliant to SAE J2602 • Support Baud Rates Kbaudwith LIN-compatible output driver • 43V load dump protected • Very low EMI meets stringent OEM requirements • ...
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... MCP2003/4 MCP2003 Block Diagram V REN WAKE MCP2004 Block Diagram V REN FAULT/TXE DS22230C-page 2 Ratiometric Reference Wake-Up Logic and Power Control OC Thermal Short Circuit Protection Protection Ratiometric Reference Wake-Up Logic and Power Control OC Thermal Short Circuit Protection Protection 2010 Microchip Technology Inc. ...
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... The LIN Bus specification states that the LIN pin must transition to the recessive state when ground is disconnected. Therefore, a loss of ground effectively forces the LIN line to a high-impedance level. 2010 Microchip Technology Inc. 1.2.3 THERMAL PROTECTION The thermal protection circuit monitors the die temperature and is able to shut down the LIN transmitter ...
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... TRANSMITTER OFF MODE Transmitter Off mode is reached whenever the transmitter is disabled either due to a Fault condition or pulling the nFAULT/TXE pin low on the MCP2004. The fault conditions include: thermal overload, bus contention or TXD timer expiration. The MCP2003/4 will go into Power-Down mode on ...
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... FIGURE 1-3: OPERATIONAL MODES STATE DIAGRAM – MCP2004 POR VREN OFF VBAT > 5.5V RX OFF TX OFF Falling edge on LIN Note: While the MCP2003 thermal shutdown, T internal logic through the ESD diodes and may damage the device. TABLE 1-1: OVERVIEW OF OPERATIONAL MODES State ...
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... TYPICAL MCP2003 APPLICATION 220 K I/O 100 nF Note: For applications with current requirements of less than 20 mA, the connection to +12V can be deleted, and voltage to the regulator supplied directly from the V EXAMPLE 1-2: TYPICAL MCP2004 APPLICATION Wake-up 220 K I/O I/O DS22230C-page 6 +12 +12 50 ...
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... EXAMPLE 1-3: TYPICAL LIN NETWORK CONFIGURATION 1 k LIN bus MCP200X Master µC 2010 Microchip Technology Inc. 40m + Return LIN bus LIN bus MCP200X MCP200X Slave 1 Slave 2 µC µC MCP2003/4 LIN bus LIN bus MCP200X Slave n <23 µC DS22230C-page 7 ...
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... Power-Down mode. Upon waking, the MCP2003 will enter Ready mode 1.5.4 FAULT/TXE This pin is only available on the MCP2004. This pin is bidirectional and allows disabling of the transmitter, as well as fault reporting related to disabling the transmitter. This pin is an open-drain output with states as defined in whenever this pin is low (‘ ...
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... The LIN bus transmitter will be re-enabled after a recessive state on the L Disabling can be caused by the LIN bus being externally held dominant Additionally, on the MCP2004, the FAULT pin will be driven low to indicate the Transmitter Off state. 1.5.8 BATTERY (V This is the Battery Positive Supply Voltage pin. ...
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... MCP2003/4 NOTES: DS22230C-page 10 2010 Microchip Technology Inc. ...
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... Some terms and names used in this data sheet deviate from those referred to in the LIN specifications. Equivalant values are shown below. LIN 2.1 Name V BAT V SUP I _ BUS LIM V BUSREC V BUSDOM 2010 Microchip Technology Inc. .......................................................................................................-0.3 to +30V Term used in the following tables not used BUS V (L ...
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... Transmitter off, bus recessive (Note 1) Transmitter off, bus recessive (Note 12V, GND 0-27V LIN Input voltage = 4.0V Input voltage = 0.5V Output voltage = 0.5V Through a current limiting resistor Input voltage = 4.0V Input voltage = 0. 5.5V LIN BB RXD , REG LBUS BB 2010 Microchip Technology Inc. ...
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... Capacitance of Slave Node C SLAVE Note 1: Internal current limited. 2.0 ms maximum recovery time (R 2: Node has to sustain the current that can flow under this condition; bus must be operational under this condition. 2010 Microchip Technology Inc. Min. Typ. Max. ) 0.6 V — — ...
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... tbus_rec(max)/2 x tbit µs Bus debounce time, 10 µs typical 35 150 µs After Bus debounce time, 52 µs typical 150 µs Vren floating — 150 µs — 80 µs Vren floating Test Conditions <= 18V RXD 2010 Microchip Technology Inc. ...
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... Thermal Resistance, 8L-SOIC Note 1: The maximum power dissipation is a function of T allowable power dissipation at an ambient temperature is P exceeded, the die temperature will rise above 150C and the MCP2003/4 will go into thermal shutdown. 2010 Microchip Technology Inc. Symbol Typ Max Units ...
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... V (V) BB DS22230C-page 16 = 6.0V to 18.0V -40°C to +125°C. A FIGURE 2-3: 0.12 0.1 0.08 -40C 25C 0.06 85C 125C 0.04 0. -40C 25C 85C 125C 18 TYPICAL IBBTO -40C 25C 85C 125C 7.3V 12V 14.4V 18V V (V) BB 2010 Microchip Technology Inc. ...
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... Match Match FAULT Sampling Hold Stable Value FAULT/TXE Output FIGURE 2- TIMING DIAGRAM REN CS V REN FIGURE 2-6: BUS TO V REN L BUS REN 2010 Microchip Technology Inc. 50% T TRANSPDF T RECPDF 50% Match Match T FAULT Stable Value T CSOR T CSPD WAKE TIMING DIAGRAM . BDB ...
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... MCP2003/4 NOTES: DS22230C-page 18 2010 Microchip Technology Inc. ...
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... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2010 Microchip Technology Inc. MCP2003/4 : Example 2004 ...
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... MCP2003/4 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22230C-page 20 Microchip Technology Drawing C04-131E Sheet 2010 Microchip Technology Inc. ...
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... Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010 Microchip Technology Inc. MCP2003/4 Microchip Technology Drawing C04-131E Sheet DS22230C-page 21 ...
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... MCP2003/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22230C-page 22 2010 Microchip Technology Inc. ...
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... N NOTE 1RWHV 2010 Microchip Technology Inc. PLO %RG\ >3', MCP2003/4 c DS22230C-page 23 ...
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... MCP2003/4 Note: DS22230C-page 24 2010 Microchip Technology Inc. ...
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... Note: 2010 Microchip Technology Inc. MCP2003/4 DS22230C-page 25 ...
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... MCP2003/4 /HDG 3ODVWLF 6PDOO 2XWOLQH 61 ± 1DUURZ 1RWH DS22230C-page 26 PP %RG\ >62,&@ 2010 Microchip Technology Inc. ...
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... Slave Node” parameter to Table 2.3. Revision C (August 2010) • Updated all references of Sleep mode to Power- Down mode, and updated the Max. parameter for Duty Cycle 2 in Section 2.4 “AC Specifica- tions”. 2010 Microchip Technology Inc. MCP2003/4 DS22230C-page 27 ...
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... MCP2003/4 NOTES: DS22230C-page 28 2010 Microchip Technology Inc. ...
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... Plastic DIP (300 mil Body), 8-lead, 14-lead SN = Plastic SOIC, (150 mil Body), 8-lead 2010 Microchip Technology Inc. MCP2003/4 . Examples: a) MCP2004-E/MD: Extended Temperature, 8L-DFN pkg. b) MCP2004-E/P: Extended Temperature, 8L-PDIP pkg. c) MCP2004-E/SN: Extended Temperature, 8L-SOIC pkg. d) MCP2004T-E/MD: Tape and Reel, Extended Temperature, 8L-DFN pkg. ...
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... MCP2003/4 NOTES: DS22230C-page 30 2010 Microchip Technology Inc. ...
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... PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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