MCP2004-E/SN Microchip Technology, MCP2004-E/SN Datasheet - Page 15

• Manufacturer Part Number: MCP2004-E/SN
• Description: IC LIN BUS BIDIRECT 8SOIC
• Manufacturer: Microchip Technology

Specifications of MCP2004-E/SN

• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 6 V to 27 V
• Package / Case: SOIC-8
• Supply Current: 90 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

2.5
 2010 Microchip Technology Inc.
THERMAL CHARACTERISTICS
Recovery Temperature
Shutdown Temperature
Short Circuit Recovery Time
Thermal Package Resistances
Thermal Resistance, 8L-DFN
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Note 1:
Thermal Specifications
The maximum power dissipation is a function of T
allowable power dissipation at an ambient temperature is P
exceeded, the die temperature will rise above 150C and the MCP2003/4 will go into thermal shutdown.
Parameter


SHUTDOWN
RECOVERY
Symbol
t
THERM



JA
JA
JA
149.5
+140
+150
35.7
89.3
Typ
1.5
JMAX
Max
5.0
, 
—
—
—
—
—
JA
D
and ambient temperature T
= (T
Units
C/W
C/W
C/W
ms
C
C
JMAX
- T
A
)
MCP2003/4
JA
. If this dissipation is
Test Conditions
A
DS22230C-page 15
. The maximum