XC3S1400AN-4FG676I Xilinx Inc, XC3S1400AN-4FG676I Datasheet - Page 86
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XC3S1400AN-4FG676I
Manufacturer Part Number
XC3S1400AN-4FG676I
Description
IC FPGA SPARTAN 3AN 676FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Datasheet
1.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S1400AN-4FG676I
Number Of Logic Elements/cells
25344
Number Of Labs/clbs
2816
Total Ram Bits
589824
Number Of I /o
502
Number Of Gates
1400000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
676-BBGA
Package
676FBGA
Family Name
Spartan®-3AN
Device Logic Units
25344
Device System Gates
1400000
Maximum Internal Frequency
667 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
502
Ram Bits
589824
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S1400AN-4FG676I
Manufacturer:
Xilinx Inc
Quantity:
10 000
User I/Os by Bank
Table 71
package. The AWAKE pin is counted as a dual-purpose I/O. The XC3S50AN FPGA in the FTG256 package has 51
unconnected balls, labeled with an N.C. type. These pins are also indicated in
Table 71: User I/Os Per Bank on XC3S50AN in the FTG256 Package
Table 72: User I/Os Per Bank on XC3S200AN and XC3S400AN in the FTG256 Package
DS557 (v4.1) April 1, 2011
Product Specification
Top
Right
Bottom
Left
Top
Right
Bottom
Left
Package
Package
Edge
Edge
Total
Total
and
Table 72
I/O Bank
I/O Bank
0
1
2
3
0
1
2
3
indicate how the available user-I/O pins are distributed between the four I/O banks on the FTG256
Maximum I/Os
Maximum I/Os
144
195
40
32
40
32
47
50
48
50
I/O
I/O
21
12
15
53
27
11
30
69
5
1
www.xilinx.com
INPUT
INPUT
20
21
7
5
2
6
6
6
2
7
All Possible I/O Pins by Type
All Possible I/O Pins by Type
Spartan-3AN FPGA Family: Pinout Descriptions
Figure
DUAL
DUAL
21
26
30
21
52
1
4
0
1
0
20.
VREF
VREF
15
21
3
3
6
3
5
5
6
5
CLK
CLK
30
32
8
8
6
8
8
8
8
8
86