PK20X128VLQ100 Freescale Semiconductor, PK20X128VLQ100 Datasheet - Page 21

• Manufacturer Part Number: PK20X128VLQ100
• Description: IC ARM CORTEX MCU 128K 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK20X128VLQ100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
5.3.2 Thermal attributes
1.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
Freescale Semiconductor, Inc.
Single-
layer (1s)
Four-layer
(2s2p)
Single-
layer (1s)
Four-layer
(2s2p)
—
—
—
1. output pins
Board
Symbol
type
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
J
A
• have C
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
Die junction temperature
Ambient temperature
Description
L
=30pF loads,
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
Description
K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table 9. Thermal operating requirements
Preliminary
Peripheral operating requirements and behaviors
52
44
43
38
33
11
2
LQFP
144
Min.
–40
–40
50
30
41
27
17
10
2
MAPBGA
144
Max.
125
105
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
1
1
1
1
2
3
4
Notes
Unit
°C
°C
21