PK40X128VLQ100 Freescale Semiconductor, PK40X128VLQ100 Datasheet - Page 19

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PK40X128VLQ100

Manufacturer Part Number
PK40X128VLQ100
Description
IC ARM CORTEX MCU 128K 144-LQFP
Manufacturer
Freescale Semiconductor
Series
Kinetisr
Datasheet

Specifications of PK40X128VLQ100

Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Data Converters
A/D 33x16b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PK40X128VLQ100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
5.1.6 EMC radiated emissions operating behaviors
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
2. V
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
5.1.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
5.1.8 Capacitance attributes
5.2 Switching specifications
Freescale Semiconductor, Inc.
V
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
RE_IEC_SAE
Symbol
kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/
Wideband TEM (GTEM) Cell Method.
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
Symbol
V
V
V
V
C
C
DD
RE1
RE2
RE3
RE4
IN_A
IN_D
= 3 V, T
Radiated emissions voltage, band 1
Radiated emissions voltage, band 2
Radiated emissions voltage, band 3
Radiated emissions voltage, band 4
IEC and SAE level
Description
A
Input capacitance: analog pins
Input capacitance: digital pins
Description
= 25 °C, f
Table 7. EMC radiated emissions operating behaviors
OSC
K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
= 12 MHz (crystal), f
Table 8. Capacitance attributes
SYS
= 96 MHz
Preliminary
band (MHz)
Frequency
0.15–1000
500–1000
150–500
0.15–50
50–150
Min.
TBD
TBD
TBD
TBD
TBD
Typ.
Max.
7
7
dBμV
Unit
Notes
Unit
pF
pF
1,
2,
General
2
3
19

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