PK20N512VLQ100 Freescale Semiconductor, PK20N512VLQ100 Datasheet - Page 35
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PK20N512VLQ100
Manufacturer Part Number
PK20N512VLQ100
Description
IC ARM CORTEX MCU 512K 144-LQFP
Manufacturer
Freescale Semiconductor
Series
Kinetisr
Datasheet
1.PK20X128VLQ100.pdf
(74 pages)
Specifications of PK20N512VLQ100
Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
Peripherals
DMA, I²S, LVD, POR, PWM, WDT
Number Of I /o
100
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Data Converters
A/D 33x16b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PK20N512VLQ100
Manufacturer:
FSL
Quantity:
55
Company:
Part Number:
PK20N512VLQ100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
where
Freescale Semiconductor, Inc.
• Writes_subsystem — minimum number of writes to each FlexRAM location for
• EEPROM — allocated FlexNVM for each EEPROM subsystem based on DEPART;
• EEESPLIT — FlexRAM split factor for subsystem; entered with the Program
• EEESIZE — allocated FlexRAM based on DEPART; entered with Program Partition
• Write_efficiency —
• n
subsystem (each subsystem can have different endurance)
entered with Program Partition command
Partition command
command
nvmcycd
• 0.25 for 8-bit writes to FlexRAM
• 0.50 for 16-bit or 32-bit writes to FlexRAM
— data flash cycling endurance
Figure 9. EEPROM backup writes to FlexRAM
K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Preliminary
Peripheral operating requirements and behaviors
35