PI3PCIE2612-BZFEX Pericom Semiconductor, PI3PCIE2612-BZFEX Datasheet - Page 15

• Manufacturer Part Number: PI3PCIE2612-BZFEX
• Description: IC PCI-E MUX/DEMUX 2X1 56TQFN
• Manufacturer: Pericom Semiconductor

Specifications of PI3PCIE2612-BZFEX

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

08-0147
Switch Signal Integrity Requirements and Test Procedures for 5.0 Gb/s
Signal integrity requirements for 5.0 Gb/s applications of the switch are specifi ed. Also included are the requirements of
the test fi xture for switch S-parameter measurements.
Signal Integrity Requirements
The procedures outlined in ANSI Electronics Industry Alliance (EIA) standards documents shall be followed:
• EIA 364-101 – Attenuation Test Procedure for Electrical Connectors, Sockets, Cable Assemblies or Interconnection
Systems
• EIA 364-90 – Crosstalk Ratio Test Procedure for Electrical Connectors, Sockets, Cable Assemblies or Interconnection
Systems
• EIA 364-108- Impedance, Refl ection Coeffi cient, Return Loss, and VSWR Measured in the Time and Frequency Do-
main Test Procedure for Electrical Connectors, Sockets, Cable Assemblies or Interconnection Systems
Signal Integrity Requirements and Test Procedures for 5.0 Gb/s
Notes:
1. The specifi ed S parameters requirements are for switch component only, not including the test fi xture effect. While the TRL calibration method is
recommended, other calibration methods are allowed.
Parameter
Differential
Insertion Loss
(DDIL)
Differential
Return Loss
(DDRL)
Intra-pair Skew
Differential Near
End Crosstalk
(DDNEXT)
Differential
Insertion Loss
(DDIL) when
switch is turned
off
Procedure
EIA 364-101
The EIA standard shall be used with the following considerations:
1. The measured differential S parameter shall be referenced to a
100 ohms differential impedance.
2. The test fi xture shall meet the test fi xture requirement defi ned in
Section 1.12.
3. The test fi xture effect shall be removed from the measured S
parameters. Refer to Note 1.
EIA 364-108
The EIA standard shall be used with the following considerations:
1. The measured differential S parameter shall be referenced to a
100 ohms differential impedance.
2. The test fi xture shall meet the test fi xture requirement in Section
1.12.
3. The test fi xture effect shall be removed. Refer to Note 1.
Intra-pair skew must be achieved by design; measurement not
required.
EIA 364-90
The EIA standard must be used with the following considerations:
1. The crosstalk requirement is with respect to all the adjacent dif-
ferential pairs
EIA 364-101
15
1:2 DP/PCIe Gen2 Display Mux, BTX Pinout
High Bandwidth, 6-Differential Channel
Requirements
≥-[0.6*(f)+0.5] dB up to 2.5 GHz (for
example, ≥-2 dB at f = 2.5 GHz);
≥-[1.2*(f-2.5)+2] dB for 2.5 GHz < f ≤ 5
GHz (for example, ≥-5 dB at f = 5 GHz);
≥-[1.6*(f-5)+5] dB for 5 GHz < f ≤ 7.5
GHz (for example, ≥-9 dB at f = 7.5
GHz);
Refer to Figure 1.
≤ -14 dB up to 2.8 GHz; ≤ -8 dB up to 5
GHz; ≤ -4 dB up to 7.5 GHz.
Refer to Figure 2.
5 ps max
-32 dB max up to 2.5 GHz;
-26 dB max up to 5.0 GHz;
-20 dB max up to 7.5 GHz;
See Figure 3.
≤ -20 dB up to 3 GHz;
PI3PCIE2612-B
PS8932C
07/31/08