TSL2561T TAOS, TSL2561T Datasheet - Page 35

Light to Digital Converters Light to Digital with I2C

TSL2561T

Manufacturer Part Number
TSL2561T
Description
Light to Digital Converters Light to Digital with I2C
Manufacturer
TAOS
Datasheets

Specifications of TSL2561T

Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 30 C
Mounting Style
SMD/SMT
Package / Case
TMB
Response Time
400ms
Output Current
6mA
Supply Voltage Range Dc
2.7V To 3.6V
Supply Current
0.6mA
Operating Temperature Range
-30°C To +70°C
Operating Temperature Min
-30°C
Rohs Compliant
Yes
Operating Temperature Max
70°C
Sensor Output
I2C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TSL2561T
Manufacturer:
IR
Quantity:
836
Part Number:
TSL2561T
Manufacturer:
AMS
Quantity:
20 000
Part Number:
TSL2561T
0
Tooling Required
Process
Additional Notes for Chipscale
Qualified Equipment
Qualified Materials
The LUMENOLOGY r Company
D
D
1. Apply solder paste using stencil
2. Place component
3. Reflow solder/cure
4. X-Ray verify (recommended for chipscale only)
Placement of the TSL2560/TSL2561 chipscale device onto the gold immersion substrate is accomplished using
a standard surface mount manufacturing process. Using a 152- m stencil with a 0.21 mm square aperture, print
solder paste onto the substrate. Machine-place the TSL2560/TSL2561 from the tape onto the substrate. A
suggest pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has a rubber tip with
a diameter of approximately 0.75 mm. The part is picked up from the center of the body.
It is important to use a substrate that has an immersion plating surface. This may be immersion gold, solder,
or white tin. Hot air solder leveled (HASL) substrates are not coplanar, making them difficult to work with.
D
D
D
D
D
D
− Solder stencil (square aperture size 0.210 mm, stencil thickness of 152 m)
− Solder stencil (aperture size 0.70 mm x 0.90 mm, stencil thickness of 152 m)
− SIEMENS 912 — Vacuum Pickup Tool Nozzle
Chipscale
TMB
EKRA E5 — Stencil Printer
ASYMTEC Century — Dispensing system
SIEMENS F5 — Placement system
VITRONICS 820 — Oven
PHOENIX — Inspector X-Ray system
Microbond solder paste, part number NC421
MANUFACTURING INFORMATION
r
www.taosinc.com
LIGHT-TO-DIGITAL CONVERTER
r
TSL2560, TSL2561
TAOS059D − DECEMBER 2005
Copyright E 2005, TAOS Inc.
35

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