TSL27711FN TAOS, TSL27711FN Datasheet - Page 33
TSL27711FN
Manufacturer Part Number
TSL27711FN
Description
Light to Digital Converters Light to Digital w/Proximity
Manufacturer
TAOS
Datasheet
1.TSL27713FN.pdf
(36 pages)
Specifications of TSL27711FN
Data Bus Width
16 bit
Peak Wavelength
640 nm, 850 nm
Maximum Operating Frequency
795 KHz
Operating Supply Voltage
2.4 V to 3.6 V
Operating Current
175 uA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 30 C
Interface Type
I2C
Maximum Fall Time
300 ns
Maximum Rise Time
300 ns
Mounting Style
SMD/SMT
Resolution
16 bit
Package / Case
DFN-6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TSL27711FN
Manufacturer:
TI
Quantity:
1 893
The LUMENOLOGY r Company
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
T
peak
T
T
T
3
2
1
Time (sec)
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above T
Peak temperature in reflow
Temperature gradient in cooling
peak
Figure 23. TSL2771 Solder Reflow Profile Graph
PARAMETER
−10°C
Table 17. TSL2771 Solder Reflow Profile
MANUFACTURING INFORMATION
t
soak
r
www.taosinc.com
REFERENCE
T
t
soak
peak
t
t
t
1
2
3
LIGHT-TO-DIGITAL CONVERTER
r
2 to 3 minutes
Max −5°C/sec
Max 60 sec
Max 50 sec
Max 10 sec
2.5°C/sec
TSL2771
with PROXIMITY SENSING
t
t
t
260°C
3
2
1
Not to scale — for reference only
TAOS100A − FEBRUARY 2010
Copyright E 2010, TAOS Inc.
TSL2771
33