SIHF12N50C-E3 Vishay, SIHF12N50C-E3 Datasheet - Page 7

MOSFET Power N-Channel 500V

SIHF12N50C-E3

Manufacturer Part Number
SIHF12N50C-E3
Description
MOSFET Power N-Channel 500V
Manufacturer
Vishay
Datasheet

Specifications of SIHF12N50C-E3

Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.46 Ohms
Forward Transconductance Gfs (max / Min)
3 S
Drain-source Breakdown Voltage
500 V
Gate-source Breakdown Voltage
30 V
Continuous Drain Current
12 A
Power Dissipation
36 W
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Package / Case
TO-220FP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SIHF12N50C-E3
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
SIHF12N50C-E3
Quantity:
70 000
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?91388.
Document Number: 91388
S10-0969-Rev. B, 26-Apr-10
Re-applied
voltage
Reverse
recovery
current
+
-
R
D.U.T.
G
*
Driver gate drive
D.U.T. I
D.U.T. V
Inductor current
V
GS
= 5 V for logic level devices
P.W.
SD
DS
waveform
waveform
SiHP12N50C, SiHB12N50C, SiHF12N50C
Peak Diode Recovery dV/dt Test Circuit
Fig. 15 - For N-Channel
Ripple ≤ 5 %
Body diode
Period
Body diode forward
+
-
• dV/dt controlled by R
• Driver same type as D.U.T.
• I
• D.U.T. - device under test
SD
Diode recovery
current
controlled by duty factor "D"
Circuit layout considerations
dV/dt
forward drop
• Low stray inductance
• Ground plane
• Low leakage inductance
dI/dt
current transformer
D =
-
G
Period
P.W.
+
V
V
I
SD
GS
DD
= 10 V*
+
-
V
DD
Vishay Siliconix
www.vishay.com
7

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