LFXP3C-3TN100I Lattice, LFXP3C-3TN100I Datasheet - Page 392
LFXP3C-3TN100I
Manufacturer Part Number
LFXP3C-3TN100I
Description
FPGA - Field Programmable Gate Array 3.1K LUTs 62 IO 1.8/ 2.5/3.3V -3 Spd I
Manufacturer
Lattice
Specifications of LFXP3C-3TN100I
Number Of Programmable I/os
62
Data Ram Size
55296
Supply Voltage (max)
3.465 V
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.71 V
Package / Case
TQFP-100
Package
100TQFP
Family Name
LatticeXP
Device Logic Units
3000
Maximum Internal Frequency
320 MHz
Typical Operating Supply Voltage
1.8|2.5|3.3 V
Maximum Number Of User I/os
62
Ram Bits
55296
Re-programmability Support
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP3C-3TN100I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
PCB cross-sectioning is another method used to verify BGA and PCB quality and reliability. After a new process
has been developed or changed or when qualifying a new vendor, it is a good practice to get physical information
from the vendor on their BGA reflow. When trace/space and drill or laser tolerances are nearing their limits, board
yield can be as be as low as 50% for the bare board fab. Cross-sections give you a good idea if the process is cor-
rect but do not guarantee each batch or each board design will behave the same way due to layout dimensions,
thermal issues, flux/paste and alignment, etc.
Figure 14-17 shows a BGA cross-section that uses a non-soldermask over bare copper-defined pad. (NSMD) pad.
Figure 14-17. BGA Cross-Section
Figure 14-18 shows “offset” micro via stack routing between layers.
Figure 14-18. Cross-Section of Micro Vias
High-resolution video cameras are used for edge inspection to verify ball seating, distortion, solder wetting, flow,
contaminates, etc. Figure 14-19 is a video view of a side/edge shot looking at BGA balls soldered down to the isp-
MACH 4000ZE Pico Evaluation Board (www.latticesemi.com/4000ze-pico-kit), an FR4 4-layer PCB.
14-17
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