AGL1000V2-FGG484 Actel, AGL1000V2-FGG484 Datasheet - Page 88
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AGL1000V2-FGG484
Manufacturer Part Number
AGL1000V2-FGG484
Description
FPGA - Field Programmable Gate Array 1M System Gates IGLOO
Manufacturer
Actel
Datasheet
1.AGL030V2-CSG81.pdf
(236 pages)
Specifications of AGL1000V2-FGG484
Processor Series
AGL1000
Core
IP Core
Maximum Operating Frequency
526.32 MHz, 892.86 MHz
Number Of Programmable I/os
300
Data Ram Size
147456
Supply Voltage (max)
1.575 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
AGL-Icicle-Kit, AGL-Dev-Kit-SCS, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FlashPro 4, FlashPro 3, FlashPro Lite
Mounting Style
SMD/SMT
Supply Voltage (min)
1.14 V
Number Of Gates
1 M
Package / Case
FPBGA-484
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AGL1000V2-FGG484
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
AGL1000V2-FGG484I
Manufacturer:
Actel
Quantity:
2
Company:
Part Number:
AGL1000V2-FGG484I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
AGL1000V2-FGG484I
Manufacturer:
MICROSEMI/美高森美
Quantity:
20 000
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IGLOO DC and Switching Characteristics
Table 2-126 • Minimum and Maximum DC Input and Output Levels
Table 2-127 • Minimum and Maximum DC Input and Output Levels
Table 2-128 • Minimum and Maximum DC Input and Output Levels
2- 74
1.2 V
LVCMOS
Drive
Strength
Notes:
1. I
2. I
3. Currents are measured at 100°C junction temperature and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
1.2 V
LVCMOS
Drive
Strength
2 mA
Notes:
1. I
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
3. Currents are measured at 100°C junction temperature and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
1.2 V
LVCMOS
Drive
Strength
1 mA
Notes:
1. I
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
3. Currents are measured at 100°C junction temperature and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
2 mA
larger when operating outside recommended ranges
larger when operating outside recommended ranges
larger when operating outside recommended ranges
IL
IH
IL
IL
is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
Min.
–0.3
Min.
–0.3 0.35 * VCCI 0.65 * VCCI
Min.
1.2 V LVCMOS (JESD8-12A)
Low-Voltage CMOS for 1.2 V complies with the LVCMOS standard JESD8-12A for general purpose 1.2 V
applications. It uses a 1.2 V input buffer and a push-pull output buffer. Furthermore, all LVCMOS 1.2 V
software macros comply with LVCMOS 1.2V wide range as specified in the JESD8-12A
specification.
–0.3
V
Applicable to Advanced I/O Banks
Applicable to Standard Plus I/O Banks
Applicable to Standard I/O Banks
V
V
VIL
0.35 * VCCI 0.65 * VCCI
VIL
0.35 * VCCI 0.65 * VCCI
V
IL
Max.
Max.
Max.
V
V
V
Min.
Min.
Min.
V
V
V
VIH
V
VIH
IH
Max.
Max.
1.26
1.26
Max.
3.6
V
V
V
0.25 * VCCI 0.75 * VCCI
0.25 * VCCI 0.75 * VCCI
0.25 * VCCI 0.75 * VCCI 1
R ev i sio n 1 8
Max.
VOL
Max.
V
Max.
VOL
V
V
OL
V
VOH
Min.
VOH
Min.
V
Min.
V
V
OH
V
mA mA
mA mA
I
mA mA
I
I
OL
OL
OL
2
2
I
I
I
OH
OH
1
OH
2
2
Max.
Max.
Max.
I
mA
TBD
mA
I
mA
TBD
I
TBD
OSH
OSH
OSH
3
3
3
Max.
Max.
mA
TBD
mA
I
I
TBD
Max.
mA
TBD
I
OSL
OSL
OSL
3
3
3
µA
I
µA
µA
I
IL
10 10
I
IL
10 10
IL
10 10
1
1
4
4
1
4
µA
I
µA
µA
I
IH
I
IH
IH
2
4
2
4
2
4
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