BLM18PG121SN1D Murata, BLM18PG121SN1D Datasheet - Page 146

EMI/RFI Suppressors & Ferrites 0603 120 OHM

BLM18PG121SN1D

Manufacturer Part Number
BLM18PG121SN1D
Description
EMI/RFI Suppressors & Ferrites 0603 120 OHM
Manufacturer
Murata
Datasheets

Specifications of BLM18PG121SN1D

Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
120 Ohms
Tolerance
25 %
Maximum Dc Current
2000 mAmps
Maximum Dc Resistance
0.05 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0603 (1608 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.05ohm
Dc Current Rating
2A
Ferrite Mounting
SMD
Ferrite Case Style
0603
Inductor Case Style
0603
No. Of Pins
2
Core Material
Ferrite
Resistance
0.05ohm
Rohs Compliant
Yes
Operating Temperature Min
-55°C
Operating Temperature Max
+125°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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(3) Reworking with Solder Iron
(1) Cleaning Temperature: 60 C max. (40 C max. for
(2) Ultrasonic
(3) Cleaning Agent
!Note
144
4. Cleaning
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150 C 60s min.*
Soldering iron power output / Tip diameter:
Temperature of soldering iron tip / Soldering time / Times:
Following conditions should be observed when cleaning
chip EMI filter.
alcohol type cleaner)
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
*
*
1
2
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
30W max. / ø3mm max.
350 C max. / 3-4s / 2 times*
NFM55P: 100 C/60s+200 C/60s
NFE31PT152Z1E9: 280 C max. / 10s max. / 2 times
1
2
(4) Ensure that flux residue is completely removed.
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
(a) Alcohol cleaning agent
(b) Aqueous cleaning agent
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
Isopropyl alcohol (IPA)
Pine Alpha ST-100S
NFp Chip EMIFILr
Soldering and Mounting
Mar.28,2011
C31E.pdf

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