BLM18PG121SN1D Murata, BLM18PG121SN1D Datasheet - Page 179

• Manufacturer Part Number: BLM18PG121SN1D
• Description: EMI/RFI Suppressors & Ferrites 0603 120 OHM
• Manufacturer: Murata

Specifications of BLM18PG121SN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 120 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 2000 mAmps
• Maximum Dc Resistance: 0.05 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.05ohm
• Dc Current Rating: 2A
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603
• Inductor Case Style: 0603
• No. Of Pins: 2
• Core Material: Ferrite
• Resistance: 0.05ohm
• Rohs Compliant: Yes
• Operating Temperature Min: -55°C
• Operating Temperature Max: +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

DLp Chip Common Mode Choke Coil
!Note
DLP
DLW
DLM
2. Solder Paste Printing and Adhesive Application
When reflow soldering the
coils, the printing must be conducted in accordance with
the following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
DLP0NS/11S/11T/31S/DLM11G
oGuideline of solder paste thickness:
*Solderability is subject to reflow conditions and
thermal conductivity. Please make sure that your
product has been evaluated in view of your
specifications with our product being mounted to your
product.
DLP0NS
DLP11S
DLP11T
DLP31S
DLM11G
DLP2AD/31D
100-150 m: DLW21S/21H/31S,
150-200 m: DLP31D/31S, DLM2HG,
DLW5AH/5BS/5BT
Series
c
d
a
chip common mode choke
5.5
2.9
0.9
b
0.3
0.7
0.5
1.0
0.5
a
0.55
0.55
0.3
0.6
0.5
DLP0NS/11S/11T/1ND/2AD/DLM11G
DLW5AH/5BS/5BT
a
b
Solder Paste Printing
0.3
0.3
0.3
0.7
0.4
c
Soldering and Mounting
0.55
0.55
0.5
2.1
0.7
d
DLW21S/H
DLW31S
DLP1ND
DLP2AD
DLP31D
Series
Series
DLW21S/21H/31S
DLM2HG
a
b
0.55
0.3
1.0
a
0.8
1.6
a
0.3
0.4
0.8
b
2.6
3.7
1.0
4.0
b
0.25
0.2
0.4
0.5
0.4
c
c
When flow soldering the
apply the adhesive in accordance with the following
conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
0.4
0.5
0.8
1.2
1.6
d
d
DLP31S/DLM2HG/DLP31D
Apply 0.3mg of bonding agent at each chip.
Coating Position of
Bonding Agent
Coating Position of
Bonding Agent
DLP31D
Adhesive Application
chip common mode choke
DLM2HG
Coating Position of
Bonding Agent
DLP31S
(in mm)
coils,
177
Mar.28,2011
C31E.pdf