DC1398A-GA Linear Technology, DC1398A-GA Datasheet - Page 21

• Manufacturer Part Number: DC1398A-GA
• Description: BOARD EVAL LTM9001-GA
• Manufacturer: Linear Technology
• Type: Baseband Receiverr

Specifications of DC1398A-GA

• Design Resources: Demo Circuit 1398A Schematic
• Frequency: 0Hz ~ 300MHz
• Kit Contents: Board, Manual
• Features: LTM9001 16bit Receiver Subsystem, DC-10MHz LPF
• Tool / Board Applications: Wireless Connectivity-ZigBee, RF, Infrared, USB
• Development Tool Type: Hardware - Eval/Demo Board
• Mcu Supported Families: LTM9001
• For Use With/related Products: LTM9001
• Lead Free Status / RoHS Status: Not applicable / Not applicable

APPLICATIONS INFORMATION
Heat Transfer
Most of the heat generated by the LTM9001 is transferred
through the bottom-side ground pads. For good electrical
and thermal performance, it is critical that all ground pins
are connected to a ground plane of suffi cient area with as
many vias as possible.
Recommended Layout
The high integration of the LTM9001 makes the PC
board layout very simple and easy. However, to optimize
its electrical and thermal performance, some layout
considerations are still necessary, see Figures 13 to 16.
• Use large PCB copper areas for ground. This helps to
dissipate heat in the package through the board and
also helps to shield sensitive on-board analog signals.
Common ground (GND) and output ground (OGND)
are electrically isolated on the LTM9001, but can be
connected on the PCB underneath the part to provide
a common return path.
• Use multiple ground vias. Using as many vias as possible
• Separate analog and digital traces as much as
The quality of the paste print is an important factor in
producing high yield assemblies. It is recommended to
use a type 3 or 4 printing no-clean solder paste. The solder
stencil design should follow the guidelines outlined in
Application Note 100. The μModule LGA Packaging Care
and Assembly Instructions is available at http://www.linear.
com/designtools/packaging/uModule_Instructions.
The LTM9001 employs gold-fi nished pads for use with
Pb-based or tin-based solder paste. It is inherently Pb-
free and complies with the JEDEC (e4) standard. The
materials declaration is available online at http://www.
linear.com/designtools/leadfree/mat_dec.jsp.
helps to improve the thermal performance of the board
and creates necessary barriers separating analog and
digital traces on the board at high frequencies.
possible, using vias to create high frequency barriers.
This will reduce digital feedback that can reduce the
signal-to-noise ratio (SNR) and dynamic range of the
LTM9001.
LTM9001-GA
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