S29GL512P11FFI020 Spansion Inc., S29GL512P11FFI020 Datasheet - Page 71
![IC, FLASH, 512MBIT, 110NS, BGA-64](/photos/19/5/190514/4243358_sml.jpg)
S29GL512P11FFI020
Manufacturer Part Number
S29GL512P11FFI020
Description
IC, FLASH, 512MBIT, 110NS, BGA-64
Manufacturer
Spansion Inc.
Specifications of S29GL512P11FFI020
Memory Type
Flash
Memory Size
512Mbit
Memory Configuration
128K X 16
Ic Interface Type
Parallel
Access Time
110ns
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
BGA
No. Of Pins
64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S29GL512P11FFI020
Manufacturer:
Spansion
Quantity:
135
Part Number:
S29GL512P11FFI020
Manufacturer:
SPANSION
Quantity:
20 000
13. Revision Summary
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2004–2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations
thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
November 21, 2006 S29GL-P_00_A3
Revision A0 (October 29, 2004)
Revision A1 (October 20, 2005)
Global
Revision A2 (October 19, 2006)
Global
Revision A3 (November 21, 2006)
AC Characteristics
Section
D a t a
S h e e t
Initial Release.
Revised all sections of document.
Revised all sections of document. Reformatted document to new template. Changed speed options
for S29GL01GP.
Erase and Program Operations table: Changed t
( A d v a n c e
S29GL-P MirrorBit
I n f o r m a t i o n )
TM
Flash Family
Description
BUSY
to a maximum specification.
69