XC6223H251MR-G Torex Semiconductor Ltd, XC6223H251MR-G Datasheet - Page 28

• Manufacturer Part Number: XC6223H251MR-G
• Description: LDO, 300MA, 2.5V, HS, LN, SOT-25
• Manufacturer: Torex Semiconductor Ltd

Specifications of XC6223H251MR-G

• Primary Input Voltage: 5.5V
• Output Voltage: 2.5V
• Dropout Voltage Vdo: 240mV
• No. Of Pins: 5
• Output Current: 300mA
• Voltage Regulator Case Style: SOT-25
• Operating Temperature Range: -40°C To +85°C
• Output Voltage Fixed: 2.5V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

● USPQ-4B03 Power Dissipation
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1.
2. Power Dissipation vs. Ambient temperature
■PACKAGING INFORMATION (Continued)
Board Mount (Tj max = 125℃)
Condition
Ambient
Soldering
Board Dimensions
Board Structure
Material
Thickness
Through-hole
XC6223
Power dissipation data for the USPQ-4B03 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
Measurement Condition (Reference data)
Ambient Temperature（℃）
600
500
400
300
200
100
0
25
25
85
Series
: Mount on a board
: Natural convection
: Lead (Pb) free
: 40 x 40 mm (1600mm
: 4 Copper Layers
: Glass Epoxy (FR-4)
: 1.6 mm
: 4 x 0.8 Diameter
Each layer is connected to the package heat-sink and
terminal pin No.1.
Each layer has approximately 800mm
45
Ampient Temperature Ta（℃）
Power Dissipation Pd（mW）
Pd vs Ta
65
2
)
550
220
85
2
copper area.
105
Thermal Resistance (℃/W)
181.82
125
Evaluation Board (Unit: mm)