LM7808CT National Semiconductor, LM7808CT Datasheet - Page 12

• Manufacturer Part Number: LM7808CT
• Description: IC, V REG +8.0V, 7808, TO-220-3
• Manufacturer: National Semiconductor

Specifications of LM7808CT

• Output Voltage: 8V
• Dropout Voltage Vdo: 2V
• No. Of Pins: 3
• Voltage Regulator Case Style: TO-220
• Operating Temperature Range: 0°C To +125°C
• Svhc: No SVHC (15-Dec-2010)
• Operating Temperature Max: 125°C
• Output Voltage Fixed: 8V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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Application Hints
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a
copper plane on the PCB and the PCB itself as a heatsink.
To optimize the heat sinking ability of the plane and PCB,
solder the tab of the plane.
shows for the TO-263 the measured values of θ
different copper area sizes using a typical PCB with 1 ounce
copper and no solder mask over the copper area used for
heatsinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. It should also
be observed that the minimum value of θ
package mounted to a PCB is 32˚C/W.
As a design aid, Figure 5 shows the maximum allowable
power dissipation compared to ambient temperature for the
TO-263 device (assuming θ
mum junction temperature is 125˚C).
FIGURE 5. Maximum Power Dissipation vs
FIGURE 4. θ
T
Area for the TO-263 Package
AMB
for the TO-263 Package
(J–A)
vs Copper (1 ounce)
(J–A)
(Continued)
is 35˚C/W and the maxi-
(J–A)
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for the TO-263
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(J–A)
for
12
Figures 6, 7 show the information for the SOT-223 package.
Figure 6 assumes a θ
51˚C/W for 2 ounce copper and a maximum junction tem-
perature of 125˚C.
Please see AN-1028 for power enhancement techniques to
be used with the SOT-223 package.
FIGURE 6. θ
FIGURE 7. Maximum Power Dissipation vs
T
AMB
for the SOT-223 Package
for the SOT-223 Package
(J–A)
(J–A)
vs Copper (2 ounce) Area
of 74˚C/W for 1 ounce copper and
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