DSPIC30F1010-20E/SO Microchip Technology, DSPIC30F1010-20E/SO Datasheet - Page 46

• Manufacturer Part Number: DSPIC30F1010-20E/SO
• Description: 6KB, Flash, 256bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 SOIC .300in T
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F1010-20E/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 6KB (2K x 24)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

TABLE 13-1:
DS70284C-page 46
AC/DC Characteristics
P11
P12
P13
P14
P15
P16
P17
P18a
P18b
P19a
P19b
Param.
No.
T
T
T
T
T
T
T
T
Tprog
T
T
ERA
ERA
DLY
R
VALID
DLY
HLD
KEY
KEY
PROG
Sym
7
8
3
1
2
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS (CONTINUED)
Delay to allow Bulk Erase to Occur
MCLR Rise Time to Enter ICSP™ mode
Data Out Valid from PGC ↑
Delay between Last PGC ↓ and MCLR ↓
MCLR ↓ to V
Delay from First MCLR ↓ to First PGC ↑
for Key Sequence on PGD
Delay from Last PGC ↓ for Key Sequence
on PGD to Second MCLR ↑
Row Programming cycle time
Row programming cycle time
Bulk/Row Erase cycle time
Bulk/Row Erase cycle time
DD
Characteristic
↓
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
Min
200
0.8
0.8
10
40
40
—
—
0
1
1
Max
100
1.0
2.6
2.6
—
—
—
—
—
4
4
© 2010 Microchip Technology Inc.
Units
ms
ms
ms
ms
ms
ms
ns
ns
ns
ns
s
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
Conditions
—
—
—
—
—
—
—