DSPIC30F2012T-30I/ML Microchip Technology, DSPIC30F2012T-30I/ML Datasheet - Page 150
![IC,DSP,16-BIT,CMOS,LLCC,28PIN,PLASTIC](/photos/6/81/68120/150-28-qfn_sml.jpg)
DSPIC30F2012T-30I/ML
Manufacturer Part Number
DSPIC30F2012T-30I/ML
Description
IC,DSP,16-BIT,CMOS,LLCC,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20ISO.pdf
(210 pages)
3.DSPIC30F2011-20ISO.pdf
(14 pages)
4.DSPIC30F2011-20ISO.pdf
(6 pages)
5.DSPIC30F2011-20ISO.pdf
(18 pages)
6.DSPIC30F2011-20IP.pdf
(26 pages)
Specifications of DSPIC30F2012T-30I/ML
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2012T-30I/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20ISO PDF datasheet #2
- DSPIC30F2011-20ISO PDF datasheet #3
- DSPIC30F2011-20ISO PDF datasheet #4
- DSPIC30F2011-20ISO PDF datasheet #5
- DSPIC30F2011-20IP PDF datasheet #6
- Current page: 150 of 210
- Download datasheet (3Mb)
dsPIC30F2011/2012/3012/3013
20.1
TABLE 20-1:
TABLE 20-2:
TABLE 20-3:
DS70139G-page 150
dsPIC30F201x-30I
dsPIC30F301x-30I
dsPIC30F201x-20E
dsPIC30F301x-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 18-pin PDIP (P)
Package Thermal Resistance, 18-pin SOIC (SO)
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin (SOIC)
Package Thermal Resistance, 44-pin QFN
Note 1:
V
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
INT
Junction to ambient thermal resistance, Theta-ja (θ
I
Range
/
O
=
=
∑
V
(
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
{
DD
V
DD
×
(
–
I
DD
V
Characteristic
OH
–
∑
} I
Rating
×
I
OH
-40°C to 125°C
-40°C to 125°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
OH
Temp Range
)
)
+
∑
(
V
OL
×
I
OL
)
dsPIC30FXXX-30I
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
20
10
—
—
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
-40
-40
-40
-40
44
57
42
49
28
(T
© 2010 Microchip Technology Inc.
P
J
INT
- T
Max
Typ
—
—
—
—
—
—
—
—
—
dsPIC30FXXX-20E
+ P
A
) / θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
20
15
Max
Unit
—
—
—
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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