DSPIC30F2020T-30I/SO Microchip Technology, DSPIC30F2020T-30I/SO Datasheet - Page 271
DSPIC30F2020T-30I/SO
Manufacturer Part Number
DSPIC30F2020T-30I/SO
Description
12KB, Flash, 512bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 SOIC .300in
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F1010-30ISO.pdf
(26 pages)
4.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F2020T-30I/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F2020T-30I/SOTR
- AC164335 PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F1010-30ISO PDF datasheet #3
- DSPIC30F1010-30ISO PDF datasheet #4
- Current page: 271 of 286
- Download datasheet (5Mb)
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
dsPIC30F1010/202X
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
DS70178C-page 269
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15
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