DSPIC30F3010-20E/ML Microchip Technology, DSPIC30F3010-20E/ML Datasheet - Page 6
![IC,DSP,16-BIT,CMOS,LLCC,44PIN,PLASTIC](/photos/6/81/68122/150-44-qfn_sml.jpg)
DSPIC30F3010-20E/ML
Manufacturer Part Number
DSPIC30F3010-20E/ML
Description
IC,DSP,16-BIT,CMOS,LLCC,44PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F3010-30ISO.pdf
(228 pages)
4.DSPIC30F3010-30ISO.pdf
(18 pages)
5.DSPIC30F3010-30ISO.pdf
(6 pages)
6.DSPIC30F3010-30ISO.pdf
(16 pages)
7.DSPIC30F3010-30ISO.pdf
(22 pages)
Specifications of DSPIC30F3010-20E/ML
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
24KB (8K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44QFN4 - SOCKET TRANS ICE 28DIP TO 44QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F3010-30ISO PDF datasheet #3
- DSPIC30F3010-30ISO PDF datasheet #4
- DSPIC30F3010-30ISO PDF datasheet #5
- DSPIC30F3010-30ISO PDF datasheet #6
- DSPIC30F3010-30ISO PDF datasheet #7
- Current page: 6 of 228
- Download datasheet (4Mb)
dsPIC30F3010/3011
Pin Diagrams (Continued)
DS70141F-page 6
Note 1:
44-Pin QFN
The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
PGC/EMUC/U1RX/SDI1/SDA/RF2
(1)
PWM3H/RE5
PWM2H/RE3
PWM3L/RE4
V
V
V
NC
NC
NC
NC
DD
DD
SS
10
11
1
2
3
4
5
6
7
8
9
dsPIC30F3010
33
32
31
30
29
28
27
26
25
24
23
OSC2/CLKO/RC15
OSC1/CLKI
V
V
V
V
NC
NC
NC
AN5/QEB/IC8/CN7/RB5
AN4/QEA/IC7/CN6/RB4
SS
SS
DD
DD
© 2010 Microchip Technology Inc.
SS
externally.
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