DSPIC30F4012-20E/SP Microchip Technology, DSPIC30F4012-20E/SP Datasheet - Page 58
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DSPIC30F4012-20E/SP
Manufacturer Part Number
DSPIC30F4012-20E/SP
Description
IC,DSP,16-BIT,CMOS,DIP,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F4012-30ISO.pdf
(238 pages)
3.DSPIC30F4012-30ISO.pdf
(18 pages)
4.DSPIC30F4012-30ISO.pdf
(6 pages)
5.DSPIC30F4012-30ISO.pdf
(16 pages)
6.DSPIC30F4012-30ISO.pdf
(22 pages)
Specifications of DSPIC30F4012-20E/SP
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
48KB (16K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
DSPIC30F401220ESP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F4012-20E/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
13.0
TABLE 13-1:
DS70102K-page 58
AC/DC CHARACTERISTICS
D110
D112
D113
D001
D002
D031
D041
D080
D090
D012
P1
P1a
P1b
P2
P3
P4
P4a
P5
P6
P7
P8
P9a
Param.
No.
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
V
I
I
V
V
V
V
V
V
C
T
T
T
T
T
T
T
T
T
T
T
T
PP
DDP
SCLK
SCLK
SCLK
SET
SET
IL
IH
OL
OH
HLD
DLY
DLY
DLY
HLD
DLY
DLY
IHH
DD
DDBULK
IO
Sym
1
2
1
1a
2
3
4
1
2
L
H
AC/DC CHARACTERISTICS
High Programming Voltage on MCLR/V
Programming Current on MCLR/V
Supply Current during programming
Supply voltage
Supply voltage for Bulk Erase
programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O Pin (PGD)
Serial Clock (PGC) period
Serial Clock (PGC) low time
Serial Clock (PGC) high time
Input Data Setup Timer to PGC ↓
Input Data Hold Time from PGC ↓
Delay between 4-bit command and
command operand
Delay between 4-bit command operand
and next 4-bit command
Delay between last PGC ↓ of command to
first PGC ↑ of VISI output
V
Input data hold time from MCLR/V
Delay between last PGC ↓ of command
word to PGD driven ↑ by programming
executive
Programming Executive Command
processing time
DD
↑ setup time to MCLR/V
Characteristic
PP
PP
PP
↑
PP
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
V
0.8 V
DD
9.00
Min
V
400
400
100
2.5
4.5
50
20
20
15
15
20
20
20
20
10
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1
2
5
SS
- 0.7
DD
0.2 V
13.25
Max
V
300
5.5
5.5
0.6
30
30
30
50
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DD
SS
© 2010 Microchip Technology Inc.
Units
mA
mA
mA
ms
μA
pF
ns
ns
ns
μs
ns
ns
ns
ns
ns
ns
ns
ns
μs
μs
μs
V
V
V
V
V
V
V
Row Erase
Program
memory
Row Erase
Data EEPROM
Bulk Erase
I
I
To meet AC
specifications
ICSP™ mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
OL
OH
Conditions
= 8.5 mA
= -3.0 mA
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