PIC16F73-E/SS Microchip Technology, PIC16F73-E/SS Datasheet - Page 21
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC16F73-E/SS
Manufacturer Part Number
PIC16F73-E/SS
Description
28 PIN, 7KB STD FLASH, 192 RAM, 22 I/O,
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F73-E/SS
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SSOP
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
PIC16F73E/SS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F73-E/SS
Manufacturer:
Microchip Technology
Quantity:
135
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F73-ISP PDF datasheet #4
- PIC16F73-ISP PDF datasheet #5
- PIC16F73-ISP PDF datasheet #6
- Current page: 21 of 688
- Download datasheet (3Mb)
1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1
Related parts for PIC16F73-E/SS
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![PIC16F73](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
![PIC16F73-I/SP](/photos/6/59/65908/150-28-dip_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 4KX14 A/D 28DIP
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F73-I/SS](/photos/6/81/68119/150-28-ssop_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 4KX14 A/D 28SSOP
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F73-E/SO](/photos/6/59/65909/150-28-soic_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 4KX14 A/D 28SOIC
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F73-I/SO](/photos/6/59/65909/150-28-soic_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 4KX14 A/D 28SOIC
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F73-I/ML](/photos/6/81/68120/150-28-qfn_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 4KX14 A/D 28QFN
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F73-I/SPG](/photos/6/59/65908/150-28-dip_tmb.jpg)
Part Number:
Description:
IC PIC MCU FLASH 4KX14 28DIP
Manufacturer:
Microchip Technology
![PIC16F73-E/ML](/photos/6/81/68120/150-28-qfn_tmb.jpg)
Part Number:
Description:
7 KB Flash, 368 RAM, 25 I/O 28 QFN 6x6mm TUBE
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F73-E/SP](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
28 PIN, 7KB STD FLASH, 192 RAM, 22 I/O,
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F1507-E/ML](/photos/16/3/160361/qfn20_tmb.jpg)
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 QFN 4x4mm TUBE
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F1507-E/P](/photos/16/12/161290/pdip20_tmb.jpg)
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 PDIP .300in TUBE
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F1507-E/SO](/photos/16/12/161297/soic20_tmb.jpg)
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SOIC .300in TUBE
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F1507-E/SS](/photos/16/12/161299/ssop20_tmb.jpg)
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 SSOP .209in TUBE
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F1507-I/ML](/photos/16/3/160361/qfn20_tmb.jpg)
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 QFN 4x4mm TUBE
Manufacturer:
Microchip Technology
Datasheet:
![PIC16F1507-I/P](/photos/16/12/161290/pdip20_tmb.jpg)
Part Number:
Description:
3.5KB Flash, 128B RAM, 18 I/O, CLC, CWG, DDS, 10-bit ADC 20 PDIP .300in TUBE
Manufacturer:
Microchip Technology
Datasheet: