B57421V2103J62 EPCOS Inc, B57421V2103J62 Datasheet - Page 10

• Manufacturer Part Number: B57421V2103J62
• Description: THERMISTOR NTC 10K OHM 5% 0805
• Manufacturer: EPCOS Inc
• Series: B574**V2r
• Type: NTCr

Specifications of B57421V2103J62

• Package / Case: 0805 (2012 Metric)
• Resistance In Ohms @ 25°c: 10K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±3%
• B25/50: 3940K
• B25/85: 3980K
• B25/100: 4000K
• Operating Temperature: -55°C ~ 125°C
• Power - Max: 210mW
• Mounting Type: Surface Mount
• Resistance: 10 KOhms
• Tolerance: 5 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 55 C to + 125 C
• Dimensions: 1.25 mm W x 2 mm L x 1.3 mm H
• Power Rating: 210 mW
• Thermistor Type: NTC
• Thermistor Tolerance: ± 5%
• Beta Value (k): 3980K
• Thermistor Case Style: 0805
• No. Of Pins: 2
• B Constant: ±3
• Beta Upper Temperature: 4000K
• Dc Resistance Max: 10kohm
• Rohs Compliant: Yes
• Beta Lower Temperature: 3940K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/75: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-2116-2; B57421V2103J 62; B57421V2103J062

Mounting instructions
1
1.1
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-
ed as well as a proper cleaning of the PCB.
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Figure 1
SMD NTC thermistors, structure of nickel barrier termination
1.1.1
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas 95%.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
1.1.2
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges 1/3.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
Nickel barrier termination
Soldering
SMD NTC thermistors
Solderability (test to IEC 60068-2-58)
Resistance to soldering heat (test to IEC 60068-2-58)
Page 10 of 20
Bath temperature ( C)
215 3
245 3
Bath temperature ( C)
260
260
5
5
Dwell time (s)
3
3
Dwell time (s)
10
10
B574**V2