B57421V2103J62 EPCOS Inc, B57421V2103J62 Datasheet - Page 14

• Manufacturer Part Number: B57421V2103J62
• Description: THERMISTOR NTC 10K OHM 5% 0805
• Manufacturer: EPCOS Inc
• Series: B574**V2r
• Type: NTCr

Specifications of B57421V2103J62

• Package / Case: 0805 (2012 Metric)
• Resistance In Ohms @ 25°c: 10K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±3%
• B25/50: 3940K
• B25/85: 3980K
• B25/100: 4000K
• Operating Temperature: -55°C ~ 125°C
• Power - Max: 210mW
• Mounting Type: Surface Mount
• Resistance: 10 KOhms
• Tolerance: 5 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 55 C to + 125 C
• Dimensions: 1.25 mm W x 2 mm L x 1.3 mm H
• Power Rating: 210 mW
• Thermistor Type: NTC
• Thermistor Tolerance: ± 5%
• Beta Value (k): 3980K
• Thermistor Case Style: 0805
• No. Of Pins: 2
• B Constant: ±3
• Beta Upper Temperature: 4000K
• Dc Resistance Max: 10kohm
• Rohs Compliant: Yes
• Beta Lower Temperature: 3940K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/75: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-2116-2; B57421V2103J 62; B57421V2103J062

2
An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of
this method is that it involves no thermal stress. The adhesives used must be chemically inert.
3
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
4
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are
permissible.
5
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-
terial may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
Relative humidity (without condensation):
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
fied:
SMDs:
Leaded components:
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
Conductive adhesion
Sealing and potting
Cleaning
Storage
12 months
24 months
Page 14 of 20
<95%, maximum 30 days per annum
75% annual mean
25 C up to 45 C
B574**V2