C1608X7R1C103K TDK Corporation, C1608X7R1C103K Datasheet - Page 6

• Manufacturer Part Number: C1608X7R1C103K
• Description: CAP CER 10000PF 16V X7R 10% 0603
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C1608X7R1C103K

• Voltage - Rated: 16V
• Capacitance: 10000pF
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Thickness: 0.037" (0.95mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-6855-2

TDK Multilayer Ceramic Chip Capacitors
Application Manual
Model of cracks generated on a dual-surface mounted board
2) Even if the shock energy is the same, the smaller the span of the circuit
Magnitude of stress and location of support pins
Vibrating parts feeder
If the parts feeder is subjected to vibrations for long periods of time, the
TDK multilayer ceramic chip capacitors may have their terminal electrodes
warn because of contact friction with the interior walls of the parts feeder.
This may lead to a degradation in solderability. Moreover, termination
material may adhere to the surface of the component, resulting in a
degradation of insulation resistance.
Controlled quantities of chip capacitors should be used in the feeder at
board (S in diagram below) the greater the shock applied to the TDK
MLC chip capacitor and the higher the rate of crack occurrence.
Therefore, when installing support pins, set their positions so that there
will be as little shock energy as possible.
Termination peeling
Support pin
Span S
Cracks
one time.
Requirements for selecting flux
Recommended flux
The more active the flux, the better the soldering finish, but the materials
that are added for cleanliness and making flux more active may reduce
the insulation performance of TDK multilayer ceramic chip capacitors. To
prevent this from happening, we recommend rosin flux with low activity
(containing 0.2% or less chlorine).
Flux types
1) It is recommended that mildly-activated rosin flux used. There are flat
2) Water soluble flux: These are made from activators and organic
Flux control
1) coating quantity
2) Periodic replacement
Cautions in using flux
Flux is one of the more important elements affecting the performance of
TDK multilayer ceramic chip capacitors. Before selecting and using flux,
check the items shown below for the best flux.
1) Use flux that has a chlorine content of 0.1wt% or less. Do not use strong
2) When soldering, keep the amount of flux coating minimized. Coat with
3) When using water soluble flux, clean thoroughly. The dross from water
Soldering
Because the TDK multilayer ceramic chip capacitors will be in direct contact
with molten solder during soldering, there will be stresses caused by the
rapid rise in heat, and there will also be the danger of such things as flux
residue and the dissolution of terminal electrode materials. Therefore,
the most important point for the soldering process when installing on the
circuit board is that attention be given to the following items when assigning
conditions.
and lustrous types.
compounds that dissolve in water, and that have superior soldering
properties in comparison with rosin fluxes.
Amount of flux coated differs according to the specific gravity of the flux.
Make adequate checks prior to use.
The moisture absorption and oxidation properties of flux result in the
degradation of solder characteristics. TDK recommends replacement
of all solder after it has been in use for two to four weeks.
flux. Use of flux with large amounts of chlorine compounds added for
activation or strong oxide flux will lead to large amounts of dross after
soldering, which may invite a lowering of chip surface insulation and
corrosion of terminal electrodes.
flux when flow soldering to improve soldering characteristics but if large
amounts of flux are used at this time it will result in the occurrence of
flux gas which presents the danger of impeding soldering properties.
We recommend the use of the foam method for limiting the amount of
flux coating.
soluble flux has the property of melting when exposed to moisture, so
in high humidity conditions, insulation resistance will be lowered by
dross that adheres to the chip surface and that will have adverse effects
on reliability. Therefore, when using water soluble flux, make sure that
the capabilities of the cleaning method and cleaning equipment are
well-maintained.
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