HDJD-S822-QR999 Avago Technologies US Inc., HDJD-S822-QR999 Datasheet - Page 10

• Manufacturer Part Number: HDJD-S822-QR999
• Description: Optical Sensor
• Manufacturer: Avago Technologies US Inc.
• Type: CMOSr

Specifications of HDJD-S822-QR999

• Sensor Output: Voltage
• Supply Voltage Range Dc: 4.5V To 5.5V
• Msl: MSL 3 - 168 Hours
• Supply Voltage Range: 4.5V To 5.5V
• Sensor Terminals: SMD
• Package: 16QFN
• Color Sensing: Color
• Operating Temperature: 0 to 70 °C
• Operating Supply Voltage: 4.5 to 5.5 V
• Package / Case: QFN
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Sensor Supply Voltage: 4.5V To 5.5V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommendations for Handling and Storage of HDJD-S822-QR999
This product is qualified as Moisture Sensitive Level 4
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reli-
ability of the product. Do refer to Avago Application Note
AN5305 Handling Of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
• Unopened moisture barrier bag (MBB) can be stored
• It is not recommended to open the MBB prior to
• It should also be sealed with a moisture absorbent
B. Control after opening the MBB
• The humidity indicator card (HIC) shall be read
• The components must be kept at <30°C/60%RH at
Package Tape & Reel Dimensions
0
at 30°C and 90%RH or less for maximum 1 year
assembly (e.g. for IQC)
material (Silica Gel) and an indicator card (cobalt
chloride) to indicate the moisture within the bag
immediately upon opening of MBB
all time and all high temperature related process
including soldering, curing or rework need to be
completed within 72hrs
SECTION B-B
NOTES:
1. A o AND B o MEASURED AT 0.3 mm ABOVE BASE OF POCKET.
2. 10 PITCHES CUMULA TIVE TOLERANCE IS ± 0.2 mm.
3. DIMENSIONS ARE IN MILLIMETERS (mm).
K o
0.30 ± 0.05
B o
B
A
B
SEE NOTE #2
SEE NOTE #2
SECTION A-A
4.00 ± 0.10
2.00 ± 0.05
A o
A
8.00 ± 0.10
∅
R 0.50 TYP.
1.55 ± 0.05
C. Control for unfinished reel
• For any unused components, they need to be stored
D. Control of assembled boards
• If the PCB soldered with the components is to be
E. Baking is required if:
• “10%” or “15%” HIC indicator turns pink
• The components are exposed to condition of
• The components floor life exceeded 72hrs
• Recommended baking condition (in component form):
in sealed MBB with desiccant or desiccator at <5%RH
subjected to other high temperature processes, the
PCB need to be stored in sealed MBB with desiccant or
desiccator at <5%RH to ensure no components have
exceeded their floor life of 72hrs
>30°C/60%RH at any time.
125°C for 24hrs
∅
A o :
B o :
K o :
PITCH:
WIDTH:
1.75 ± .10
1.50 (MIN.)
5.50 ± 0.05
12.00
5.30
5.30
2.20
8.00
12.00 ± 0.10